Clustered functional polyorganosiloxanes, processes for forming same and methods for their use

ABSTRACT

A hydrosilylation process is used to prepare a clustered functional polyorganosiloxane. The clustered functional polyorganosiloxane comprises a reaction product of a reaction of a) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more radical curable groups selected from an acrylate group and a methacrylate group; in the presence of d) a hydrosilylation catalyst, and e) an isomer reducing agent. The weight percent of silicon bonded hydrogen atoms in component b) divided by the weight percent of aliphatically unsaturated organic groups in component a) (the SiH b /Vi a  ratio) ranges from 4/1 to 20/1. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a U.S. national stage filing under 35 U.S.C. § 371 of PCT Application No. PCT/US14/015562 filed on 10 Feb. 2014, currently pending, which claims the benefit of U.S. Provisional Patent Application No. 61/763,118 filed 11 Feb. 2013 under 35 U.S.C. § 119 (e). PCT Application No. PCT/US14/015562 and U.S. Provisional Patent Application No. 61/763,118 are hereby incorporated by reference.

The present invention relates to clustered functional polyorganosiloxanes and related processes for forming clustered functional polyorganosiloxanes. More specifically, the present invention relates to a clustered functional polyorganosiloxane that comprises the reaction product of a) a polyorganosiloxane having an average of at least 2 aliphatically unsaturated organic groups per molecule; b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and c) a reactive species having, per molecule, at least one aliphatically unsaturated organic group and one or more radical curable groups selected from acrylate groups and methacrylate groups in the presence of d) a hydrosilylation catalyst and e) an isomer reducing agent.

Polyorganosiloxane compositions that cure to elastomeric materials are well known. Such compositions may be prepared by mixing polydiorganosiloxanes having curable (e.g., hydrolyzable, radiation curable, or heat curable) groups with crosslinking agents and/or catalysts, as needed. Generally, the polydiorganosiloxanes may have 1 to 3 reactive groups per chain end. Compositions including these components can then be cured, for example, by exposure to atmospheric moisture, exposure to radiation, or exposure to heat, depending on the curable groups present.

The cure rate of a particular composition depends on various factors including the type and number reactive group(s) present. It is known that different groups have different reactivities. For example, in the presence of moisture, a silicon-bonded acetoxy group will usually hydrolyze more rapidly than a silicon-bonded alkoxy group when all other conditions are the same. Furthermore, even the same type of curable group can have different reactivities depending on the number of those curable groups bonded to a particular silicon atom. For example, if a polydiorganosiloxane has three silicon-bonded alkoxy groups bonded to one silicon atom on a chain end, then the first alkoxy group is generally most reactive (reacts most quickly), but after the first alkoxy group reacts, it takes a longer time for the second alkoxy group bonded to the same silicon atom to react, and even longer for the third. Therefore, there is a continuing need to prepare clustered functional polyorganosiloxanes having more of the “most” reactive groups per molecular molecular terminal.

Furthermore, to show utility for certain applications, such as silicone adhesive applications, a filler may be added to the composition to improve the physical property profile (e.g., increase tensile strength and increase % elongation to break) of the resulting cured product of the composition. The nature of the filler, its chemistry, particle size and surface chemistry have all been shown to influence the magnitude of the interaction between polyorganosiloxanes and the filler and consequently the ultimate physical properties. Other properties such as adhesion and dispensability also play a role in the performance and commercial acceptance of a composition for adhesive applications. Silicone adhesives generally have tensile properties in excess of 200 pounds per square inch (psi) and 100% elongation, with adhesion to a wide variety of metal, mineral and plastic surfaces.

The synthesis of ‘dumb-bell’ silicone polymers, in which long polymer chains are capped with cyclic, linear and star-shaped species having one or more organo-functional groups has been disclosed. Such polymers have been described which can undergo a number of cure chemistries, e.g., epoxy (glycidyl, alkylepoxy, and cycloaliphatic epoxy), methacrylate, acrylate, urethanes, alkoxy, or addition.

It is desirable to make multifunctional end blocked polymers (clustered functional polyorganosiloxanes) in which the curable groups are clustered at the ends/termini of the polymers. The combination of clustered functional groups with nonfunctional polymer chains separating them in the ‘dumb-bell’ silicone polymers may provide higher physical properties with the minimum drop in cure rate. This approach has been demonstrated for ‘dumb-bell’ silicone polymers in which the curable groups are the same (for example, all curable groups clustered at the polymer chain ends may be either epoxy or alkoxy). This approach has also been demonstrated for so called ‘multiple cure’ systems in which the curable groups differ, for example, all curable groups clustered at the polymer terminals may be a combination of epoxy and alkoxy groups.

In known processes for making these ‘dumb-bell’ silicone polymers, these polymers are prepared in multiple steps. First, a silicone hydride functional ‘dumb-bell’ intermediate is prepared via the reaction of vinyl-end blocked linear polyorganosiloxanes with cyclic, linear or branched silicone hydrides. This initial step is followed by the addition of a reagent to neutralize the platinum group metal catalyst and/or a purification step to remove the silicone hydride functional ‘dumb-bell’ intermediate from the unreacted species and by-products because continued presence of the catalyst at elevated temperatures over time leads to gelation, typically through the ring opening of the cyclic end blocks or crosslinking of the remaining silicon bonded hydrogen atoms. Several approaches to prevent gelation include using platinum group metal catalyst poisons, silylating agents, or catalyst inhibitors such as diallyl maleate, to deactivate the catalyst after the silicone hydride functional ‘dumb-bell’ intermediate is formed. This allows purification (e.g., by stripping or distillation) of the intermediate at elevated temperature to remove solvents, unreacted silicone hydrides, and reaction by-products. The problem with this solution is that it makes it necessary to add more platinum group metal catalyst (an added expense) and higher temperature, typically >80° C. for longer periods to achieve subsequent reactions with unsaturated organo-functional moieties, thereby increasing the time required to perform the process. The increased temperature can be particularly problematic in small ‘dumb-bell’ species in which a large exotherm is typically associated with the hydrosilylation process. The elevated initiation temperature and large exotherms make heat management in industrial process problematic. The unsaturated groups (e.g., methacrylate, acrylate, vinyl or allyl) can autopolymerize via unwanted radical process. These radical processes can be mitigated by the addition of polymerization inhibitors such as hydroquinone (HQ), 4-methoxyphenol (MEHQ), butylated hydroxytoluene (BHT), phenothiazine (PTZ), etc. However, in the case of methacrylate functional materials even with radical inhibitors present there is a high incidence of methacrylate autopolymerization in this multiple step process. For these reasons, there is a need for a process with minimal process steps and minimal thermal history, as this may reduce or eliminate the tendency for ring opening and autopolymerization. This may allow greater latitude in organic functional groups, as well as reduce cost due to the additional platinum group metal catalyst and time consuming process steps associated with the known processes.

Furthermore, uses of the ‘dumb-bell’ silicone polymers produced by known the process described above have been limited due to the difficulties associated with formulating fillers with these polymers. The addition of fillers increases the physical properties of cured silicone products such as rubbers, sealants, and adhesives. The fillers, exemplified by fumed silica, used in such compositions are inherently hydrophilic due to surface silanol groups, which lead to severe problems in processing and use. The water affinity of the silanol groups can lead to dielectric breakdown, corrosion, and gelation of adhesion promoters, catalysts, and coupling agents. The silanol groups also lead to larger than required interactions between the polyorganosiloxanes and the silica surface that result in material with too high of a viscosity to dispense or handle, and which exhibits crepe hardening. It is therefore common practice to use fumed silica, which has been pretreated with hydrophobic species to mitigate these problems. These fillers can be pretreated by the silica manufacturers, e.g., Cabosil® TS-530 and TS-720 are fumed silicas treated with hexamethyldisilazane (HMDZ) and polydimethylsiloxane, respectively, from Cabot Specialty Chemicals, Inc. of Billerica, Mass., USA, or the fillers can be treated in situ as part of the production process.

Despite the advantages of fumed silica, product formulators have cited problems with both hydrophobic and hydrophilic forms of fumed silica. For example, because of its moisture-absorbing silanol groups, hydrophilic fumed silica tends to cause problems in electronic adhesives or coating applications because the increased water concentration decreases electrical resistance. Additionally, in coating applications, this moisture, introduced by the hydrophilic fumed silica, can accelerate corrosion of the coated substrate. Also, the shear-thinning efficiency of hydrophilic fumed silica is often inadequate, which is thought to result from adsorption of the liquid onto the fumed silica surface, preventing silica aggregation and thus shear-thinning.

It is possible to make the ‘dumb-bell’ polyorganosiloxanes first and then, in a subsequent process step, disperse a desired amount of filler to get high tensile properties. However, the shear encountered in dispersing the treated filler leads to the formation of new untreated silica, hence silanol groups, as the particles are broken and fractured. This may lead to instability in the rheology and storage properties of the ‘dumb-bell’ polyorganosiloxanes and may also reduce the adhesive properties of a composition containing the ‘dumb-bell’ polyorganosiloxanes, and cured products thereof, to metals. Fumed silicas can also be cumbersome to process during manufacture. When adding fumed silica to a composition containing a ‘dumb-bell’ polyorganosiloxane described above, even high shear blending may be insufficient to disperse the fumed silica particles. It is often necessary to add a process step where the fumed silica-polymer mixture must be passed through a media mill or a three-roll mill to sufficiently disperse the silica. Furthermore, there is the danger of overdispersing fumed silica which breaks the silica aggregates, exposing untreated silica surfaces, and ruining the shear-thinning properties. Eliminating the need for these extra process steps as well as avoiding the danger of overdispersing the silica would be highly desirable to product formulators. Therefore, there is a need in the electronics industry for a process to synthesize a clustered functional polyorganosiloxane in the presence of a treated filler.

One such process developed to address this need is described in U.S. Patent Publication No. 2012/0245272 to Dent et al., in which a process for preparing a clustered functional polyorganosiloxane is disclosed.

BRIEF SUMMARY OF THE INVENTION

A clustered functional polyorganosiloxane comprising a reaction product of a reaction of:

a) a polyorganosiloxane having an average of at least 2 aliphatically unsaturated organic groups per molecule;

b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and

c) a reactive species having, per molecule, at least one aliphatically unsaturated organic group and one or more radical curable groups selected from acrylate groups and methacrylate groups;

in the presence of d) a hydrosilylation catalyst and e) an isomer reducing agent.

The weight percent of silicon bonded hydrogen atoms in component b) divided by the weight percent of aliphatically unsaturated organic groups in component a) (the SiH_(b)/Vi_(a) ratio) ranges from 4/1 to 20/1. A product prepared by the process is a clustered functional polyorganosiloxane having more than one curable group at each molecular terminal of the polyorganosiloxane of component a).

Processes for forming the clustered functional polyorganosiloxane are also provided. The clustered functional polyorganosiloxane prepared by the process may be used in a curable silicone composition.

The clustered functional polyorganosiloxane produced in accordance with the present invention utilizing a sufficient amount of isomer reducing agent e) results in a reduction in the amount of D(Oz) units present in the formed clustered functional polyorganosiloxane, as measured by NMR, which corresponds to a reduction in the beta-addition of SiH groups of the polyorganosiloxane (ii) to the aliphatically unsaturated group of the reactive species c) as compared with clustered functional polyorganosiloxane formed in the absence of the isomer reducing agent e). The clustered functional polyorganosiloxane has improved storage stability and bath life as compared to a clustered functional polyorganosiloxane prepared without the isomer reducing agent e) while still possessing similar physical properties.

DETAILED DESCRIPTION OF THE INVENTION

The articles ‘a’, ‘an’, and ‘the’ each refer to one or more, unless otherwise indicated. All amounts, ratios, and percentages in this application are by weight, unless otherwise indicated. All kinematic viscosities were measured at 25° C., unless otherwise indicated.

The present invention discloses clustered functional polyorganosiloxane compositions and their use in curable silicone compositions.

A process is useful for making a clustered functional polyorganosiloxane. In a first embodiment, the process may comprise:

1) concurrently reacting components comprising

-   -   a) a polyorganosiloxane having an average, per molecule, of at         least 2 aliphatically unsaturated organic groups,     -   b) a polyorganohydrogensiloxane having an average, per molecule,         of 4 to 15 Si atoms and at least 4 silicon bonded hydrogen atoms         per aliphatically unsaturated organic group in component a), and     -   c) a reactive species having, per molecule, at least 1         aliphatically unsaturated organic group and 1 or more radical         curable groups selected from acrylate groups and methacrylate         groups;         in the presence of d) a hydrosilylation catalyst and e) an         isomer reducing agent.

In this process of the first embodiment, the components in step 1) may further comprise f) a filler, g) a non-reactive silicone resin, or a combination thereof. The processes described above may optionally further comprise the steps of: 2) adding a catalyst inhibitor to deactivate the catalyst after step 1), and 3) purifying the product of step 2).

Alternatively, in a second embodiment, the process may comprise:

I) concurrently reacting components comprising

a) the polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; and

b) the polyorganohydrogensiloxane having an average, per molecule, of 4 to 15 Si atoms and at least 4 silicon bonded hydrogen atoms per aliphatically unsaturated organic group in component a),

in the presence of d) the hydrosilylation catalyst; and thereafter

II) reacting the product of step I) with an component comprising:

c) the reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and one or more radical curable groups selected from acrylate groups and methacrylate groups;

in the presence of e) an isomer reducing agent;

with the proviso that the components in step I) and/or step II) further comprise f) a filler, g) a non-reactive silicone resin, or a combination thereof; and with the proviso that no intermediate purification step is performed between step I) and step II), and with the proviso that the SiH_(b)/Vi_(a) ratio ranges from 4/1 to 20/1, and a product prepared by the process has, on average, more than one curable group at each molecular terminal of the polyorganosiloxane of component a).

The process of the second embodiment may optionally further comprise the steps of: III) adding a catalyst inhibitor to deactivate the catalyst after step II), and IV) purifying the product of step III). The step of purifying the products in the above processes may be performed by any convenient means, such as stripping or distillation, optionally under vacuum.

The components used in the process of the second embodiment described above comprise:

-   -   a) a polyorganosiloxane having an average, per molecule, of at         least 2 aliphatically unsaturated organic groups;     -   b) a polyorganohydrogensiloxane having an average of 4 to 15         silicon atoms per molecule;     -   c) a reactive species having, per molecule, at least 1         aliphatically unsaturated organic group and 1 or more radical         curable groups selected from acrylate groups and methacrylate         groups;     -   d) a hydrosilylation catalyst; and     -   e) an isomer reducing agent.

The components of the clustered functional polyorganosiloxane, which are used in the process of either the first embodiment or the second embodiment, are described below.

Component a) is a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups, which are capable of undergoing a hydrosilylation reaction with a silicon bonded hydrogen atom of component b). Component a) may have a linear or branched structure. Alternatively, component a) may have a linear structure. Component a) may be a combination comprising two or more polyorganosiloxanes that differ in at least one of the following properties: structure, viscosity, degree of polymerization, and sequence.

Component a) has a minimum average degree of polymerization (average DP) of 100. Alternatively, average DP of component a) may range from 100 to 1000. The distribution DP of polyorganosiloxanes of component a) can be bimodal. For example, component a) may comprise one alkenyl terminated polydiorganosiloxane with a DP of 60 and another alkenyl terminated polydiorganosiloxane with a DP higher than 100, provided that average DP of the polydiorganosiloxanes ranges from 100 to 1000. However, suitable polyorganosiloxanes for use in component a) have a minimum degree of polymerization (DP) of 10, provided that polyorganosiloxanes with DP less than 10 are combined with polyorganosiloxanes having DP greater than 100. Suitable polydiorganosiloxanes for component a) are known in the art and are commercially available. For example, Dow Corning® SFD-128 has DP ranging from 800 to 1000, Dow Corning® SFD 120 has DP ranging from 600 to 700, Dow Corning® 7038 has DP of 100, and Dow Corning® SFD-119 has DP of 150. All of these are vinyl-terminated polydimethylsiloxanes are commercially available from Dow Corning Corporation of Midland, Mich., USA. When component a) has a bimodal distribution, the polyorganosiloxane with the lower DP (low DP polyorganosiloxane) is present in a lower amount than the polyorganosiloxane with the higher DP (high DP polyorganosiloxane). For example, in a bimodal distribution, the ratio of low DP polyorganosiloxane/high DP polyorganosiloxane may range from 10/90 to 25/75.

Component a) is exemplified by polyorganosiloxanes of formula (I), formula (II), or a combination thereof. Formula (I) is R¹ ₂R²SiO(R¹ ₂SiO)_(a)(R¹R²SiO)_(b)SiR¹ ₂R², and formula (II) is R¹ ₃SiO(R¹ ₂SiO)_(c)(R¹R²SiO)_(d)SiR¹ ₃. In these formulae, each R¹ is independently a monovalent organic group free of aliphatic unsaturation, each R² is independently an aliphatically unsaturated organic group, subscript a has an average value ranging from 2 to 1000, subscript b has an average value ranging from 0 to 1000, subscript c has an average value ranging from 0 to 1000, and subscript d has an average value ranging from 4 to 1000. In formulae (I) and (II), 10≤(a+b)≤1000 and 10≤(c+d)≤1000.

Suitable monovalent organic groups for R¹ include, but are not limited to, monovalent hydrocarbon groups exemplified by alkyl such as methyl, ethyl, propyl, butyl, pentyl, octyl, undecyl, and octadecyl; cycloalkyl such as cyclohexyl; and aryl such as phenyl, tolyl, xylyl, benzyl, and 2-phenylethyl. Each R² is independently an aliphatically unsaturated monovalent organic group. R² may be an aliphatically unsaturated monovalent hydrocarbon group exemplified by alkenyl groups such as vinyl, allyl, propenyl, and butenyl; and alkynyl groups such as ethynyl and propynyl.

Component a) may comprise a polydiorganosiloxane such as i) dimethylvinylsiloxy-terminated polydimethylsiloxane, ii) dimethylvinylsiloxy-terminated poly(dimethylsiloxane/methylvinylsiloxane), iii) dimethylvinylsiloxy-terminated polymethylvinylsiloxane, iv) trimethylsiloxy-terminated poly(dimethylsiloxane/methylvinylsiloxane), v) trimethylsiloxy-terminated polymethylvinylsiloxane, vi) dimethylvinylsiloxy-terminated poly(dimethylsiloxane/methylphenylsiloxane), vii) dimethylvinylsiloxy-terminated poly(dimethylsiloxane/diphenylsiloxane), viii) phenyl, methyl, vinyl-siloxy-terminated polydimethylsiloxane, ix) dimethylhexenylsiloxy-terminated polydimethylsiloxane, x) dimethylhexenylsiloxy-terminated poly(dimethylsiloxane/methylhexenylsiloxane), xi) dimethylhexenylsiloxy-terminated polymethylhexenylsiloxane, xii) trimethylsiloxy-terminated poly(dimethylsiloxane/methylhexenylsiloxane), or xiii) a combination thereof.

Component b) is a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule. Component b) has an average of at least 4 silicon bonded hydrogen atoms per aliphatically unsaturated organic group in component a). Component b) may be cyclic, branched, or linear. Alternatively, component b) may be cyclic. Component b) may be a combination comprising two or more polyorganohydrogensiloxanes that differ in at least one of the following properties: structure, viscosity, degree of polymerization, and sequence.

Component b) may be a cyclic polyorganohydrogensiloxane having an average of 4 to 15 siloxane units per molecule. The cyclic polyorganohydrogensiloxane may have formula (III), where formula (III) is (R³ ₂SiO_(2/2))_(e)(HR³SiO_(2/2))_(f), in which each R³ is independently a monovalent organic group free of aliphatic unsaturation, subscript e has an average value ranging from 0 to 10, subscript f has an average value ranging from 4 to 15, and a quantity (e+f) has a value ranging from 4 to 15, alternatively 4 to 12, alternatively 4 to 10, alternatively 4 to 6, and alternatively 5 to 6. Monovalent organic groups suitable for R³ include, but are not limited to, monovalent hydrocarbon groups exemplified by alkyl such as methyl, ethyl, propyl, butyl, pentyl, octyl, undecyl, and octadecyl; cycloalkyl such as cyclohexyl; and aryl such as phenyl, tolyl, xylyl, benzyl, and 2-phenylethyl.

Alternatively, component b) may be a branched polyorganohydrogensiloxane. The branched polyorganohydrogensiloxane for component b) may have formula (IV), where formula (IV) is Si—(OSiR⁴ ₂)_(g)(OSiHR⁴)_(g′)(OSiR⁴ ₃)_(h)(OSiR⁴ ₂H)_((4-h)), in which each R⁴ is independently a monovalent organic group free of aliphatic unsaturation, subscript g has a value ranging from 0 to 10, subscript g′ has a value ranging from 0 to 10, and subscript h has a value ranging from 0 to 1.

Alternatively, subscript g may be 0. When subscript g′ is 0, then subscript h is also 0. Monovalent organic groups suitable for R⁴ include, but are not limited to, monovalent hydrocarbon groups exemplified by alkyl such as methyl, ethyl, propyl, butyl, pentyl, octyl, undecyl, and octadecyl; cycloalkyl such as cyclohexyl; and aryl such as phenyl, tolyl, xylyl, benzyl, and 2-phenylethyl.

Alternatively, component b) may be a linear polyorganohydrogensiloxane having an average of at least 4 silicon bonded hydrogen atoms per molecule. The linear polyorganohydrogensiloxane for component b) may have a formula selected from (V), (VI), or a combination thereof, where formula (V) is R⁵ ₂HSiO(R⁵ ₂SiO)_(i)(R⁵HSiO)_(j)SiR⁵ ₂H, formula (VI) is R⁵ ₃SiO(R⁵ ₂SiO)_(k)(R⁵HSiO)_(m)SiR⁵ ₃; where each R⁵ is independently a monovalent organic group free of aliphatic unsaturation, subscript i has an average value ranging from 0 to 12, subscript j has an average value ranging from 2 to 12, subscript k has an average value ranging from 0 to 12, and subscript m has an average value ranging from 4 to 12 where 4≤(i+j)≤13 and 4≤(k+m)≤13. Monovalent organic groups suitable for R⁵ include, but are not limited to, monovalent hydrocarbon groups exemplified by alkyl such as methyl, ethyl, propyl, butyl, pentyl, octyl, undecyl, and octadecyl; cycloalkyl such as cyclohexyl; and aryl such as phenyl, tolyl, xylyl, benzyl, and 2-phenylethyl.

Component a) and component b) may be present in amounts sufficient to provide a weight percent of silicon bonded hydrogen atoms in component b)/weight percent of unsaturated organic groups in component a) (commonly referred to as SiH_(b)/Vi_(a) ratio) ranging from 4/1 to 20/1, alternatively 4/1 to 10/1, and alternatively 5/1 to 20/1. Without wishing to be bound by theory, it is thought that if SiH_(b)/Vi_(a) ratio is 30/1 or higher, the components may crosslink to form a product with undesirable physical properties; and if SiH_(b)/Vi_(a) ratio is less than 4/1, the product of the process may not have sufficient clustered functional groups to have fast enough cure speed, particularly if a monofunctional reactive species (having one curable group per molecule) is used as component c).

Without wishing to be bound by theory, it is thought that using an excess of silicon bonded hydrogen atoms in component b), relative to aliphatically unsaturated organic groups in component a), may reduce the possibilities of producing high homologs of the clustered functional polyorganosiloxanes, which tend to be insoluble in, and may reduce storage life of, a curable silicone composition containing the clustered functional polyorganosiloxane prepared by the process described herein. The excess of silicon bonded hydrogen atoms in component b) may also result in small (relatively low DP) clustered functional polyorganosiloxanes, which may act as reactive diluents or viscosity modifiers and adhesion promoters. It is difficult to make these highly functional small molecules in an industrial environment because the inhibiting nature of small highly functional silicone hydrides means temperatures above 50° C. are typically required to initiate the hydrosilylation process. This is then followed by a large exotherm, which can be dangerous in the presence of large volumes of solvent, or if careful monitoring of reagents is not used to control the temperature. By simply changing the SiH_(b)/Vi_(a) ratio, these species can be made in a dilute solution of clustered functional polyorganosiloxane and filler, thereby significantly reducing gelation and chance of fire due to uncontrolled exothermic reaction.

Component c) is a reactive species. The reactive species may be any species that can provide the curable groups in the clustered functional polyorganosiloxane. The reactive species is distinct and different from components a) and b) and has an average, per molecule, of at least one aliphatically unsaturated organic group that is capable of undergoing an addition reaction with a silicon bonded hydrogen atom of component b). Component c) further comprises one or more radical curable groups per molecule. The radical curable groups are functional (reactive) groups that render the clustered functional polyorganosiloxane (prepared by the process described above) radiation curable. The radical curable groups on component c) may be selected from acrylate groups and methacrylate groups and combinations thereof.

For example, component c) may comprise a silane of formula (VIII), where formula (VIII) is R⁸ _(o)SiR⁹ _((3-o)); in which subscript o has a value ranging from 1 to 3, each R⁸ is independently an aliphatic ally unsaturated organic group, and each R⁹ is independently selected from an organic group containing an acrylate group and an organic group containing a methacrylate group.

Alternatively, component c) may comprise an organic compound (which does not contain a silicon atom). The organic compound for component c) may have an average per molecule of 1 to 2 aliphatically unsaturated organic groups, such as alkenyl or alkynyl groups, and one or more reactive groups selected from an acrylate group and a methacrylate group. Examples of suitable organic compounds for component c) include, but are not limited to, an allyl acrylate and allyl methacrylate (AMA); and combinations thereof.

The amount of component c) depends on various factors including the type, amount, and SiH content of component b) and the type of component c) selected. However, the amount of component c) is sufficient to make SiH_(tot)/Vi_(tot) range from 1/1 to 1/1.4, alternatively 1/1.2 to 1.1/1. The ratio SiH_(tot)/Vi_(tot) means the weight percent of silicon bonded hydrogen atoms on component b) and, if present component g) the chain extender and/or component h) the endcapper (described below), divided by weight percent of aliphatically unsaturated organic groups on components a) and c) combined.

Component d) is a hydrosilylation catalyst which accelerates the reaction of components a), b), and c). Component d) may be added in an amount sufficient to promote the reaction of components a), b), and c), and this amount may be, for example, sufficient to provide 0.1 parts per million (ppm) to 1000 ppm of platinum group metal, alternatively 1 ppm to 500 ppm, alternatively 2 ppm to 200, alternatively 5 ppm to 150 ppm, based on the combined weight of all components used in the process.

Suitable hydrosilylation catalysts are known in the art and commercially available. Component d) may comprise a platinum group metal selected from platinum (Pt), rhodium, ruthenium, palladium, osmium or iridium metal or organometallic compound thereof, or a combination thereof. Component d) is exemplified by compounds such as chloroplatinic acid, chloroplatinic acid hexahydrate, platinum dichloride, and complexes of said compounds with low molecular weight organopolysiloxanes or platinum compounds microencapsulated in a matrix or coreshell type structure. Complexes of platinum with low molecular weight organopolysiloxanes include 1,3-diethenyl-1,1,3,3-tetramethyldisiloxane complexes with platinum. These complexes may be microencapsulated in a resin matrix. Alternatively, the catalyst may comprise 1,3-diethenyl-1,1,3,3-tetramethyldisiloxane complex with platinum. When the catalyst is a platinum complex with a low molecular weight organopolysiloxane, the amount of catalyst may range from 0.04% to 0.4% based on the combined weight of the components used in the process.

Suitable hydrosilylation catalysts for component d) are described in, for example, U.S. Pat. Nos. 3,159,601; 3,220,972; 3,296,291; 3,419,593; 3,516,946; 3,814,730; 3,989,668; 4,784,879; 5,036,117; and 5,175,325 and EP 0 347 895 B. Microencapsulated hydrosilylation catalysts and methods of preparing them are known in the art, as exemplified in U.S. Pat. No. 4,766,176; and U.S. Pat. No. 5,017,654.

Component e) is an isomer reducing agent. In certain embodiments, the isomer reducing agent comprises a carboxylic acid compound. The carboxylic acid compound may comprise (1) carboxylic acid, (2) an anhydride of a carboxylic acid, (3) a carboxylic silyl ester, and/or (4) a substance that will produce the above-mentioned carboxylic acid compounds (i.e., (1), (2), and/or (3)) through a reaction or decomposition in the reaction of the method. It is to be appreciated that a mixture of one or more of these carboxylic acid compounds may be utilized as the isomer reducing agent. For example, a carboxylic silyl ester may be utilized in combination with an anhydride of a carboxylic acid as the isomer reducing agent. In addition, a mixture within one or more types of carboxylic acid compounds may be utilized as the isomer reducing agent. For example, two different carboxylic silyl esters may be utilized in concert, or two carboxylic silyl esters may be utilized in concert with an anhydride of a carboxylic acid.

When the isomer reducing agent comprises (1) carboxylic acid, any carboxylic acid having carboxyl groups may be utilized. Suitable examples of carboxylic acids include saturated carboxylic acids, unsaturated carboxylic acids, monocarboxylic acids, and dicarboxylic acids. A saturated or unsaturated aliphatic hydrocarbon group, aromatic hydrocarbon group, halogenated hydrocarbon group, hydrogen atom, or the like is usually selected as the portion other than the carboxyl groups in these carboxylic acids. Specific examples of suitable carboxylic acids include saturated monocarboxylic acids such as formic acid, acetic acid, propionic acid, n-butyric acid, isobutyric acid, hexanoic acid, cyclohexanoic acid, lauric acid, and stearic acid; saturated dicarboxylic acids such as oxalic acid and adipic acid; aromatic carboxylic acids such as benzoic acid and para-phthalic acid; carboxylic acids in which the hydrogen atoms of the hydrocarbon groups of these carboxylic acids have been substituted with a halogen atom or an organosilyl group, such as chloroacetic acid, dichloroacetic acid, trifluoroacetic acid, para-chlorobenzoic acid, and trimethylsilylacetic acid; unsaturated fatty acids such as acrylic acid, methacrylic acid, and oleic acid; and compounds having hydroxy groups, carbonyl groups, or amino groups in addition to carboxyl groups, namely, hydroxy acids such as lactic acid, keto acids such as acetoacetic acid, aldehyde acids such as glyoxylic acid, and amino acids such as glutamic acid.

When the isomer reducing agent comprises (2) an anhydride of carboxylic acid, suitable examples of anhydrides of carboxylic acids include acetic anhydride, propionic anhydride, and benzoic anhydride. These anhydrides of carboxylic acids may be obtained via a reaction or decomposition in the reaction system include acetyl chloride, butyryl chloride, benzoyl chloride, and other carboxylic acid halides, carboxylic acid metal salts such as zinc acetate and thallium acetate, and carboxylic esters that are decomposed by light or heat, such as (2-nitrobenzyl) propionate.

In embodiments where the isomer reducing agent comprises (3) a carboxylic silyl ester, suitable examples of carboxylic silyl esters are trialkylsilylated carboxylic acids, such as trimethylsilyl formate, trimethylsilyl acetate, triethylsilyl propionate, trimethylsilyl benzoate, and trimethylsilyl trifluoroacetate; and di-, tri-, or tetracarboxysilylates, such as dimethyldiacetoxysilane, diphenyldiacetoxysilane, methyltriacetoxysilane, ethyltriacetoxysilane, vinyltriacetoxysilane, di-t-butoxydiacetoxysilane, and silicon tetrabenzoate.

The isomer reducing agent is typically utilized in an amount ranging from 0.001 to 1 weight percent, alternatively from 0.01 to 0.1 weight percent, based on the total weight of the composition. Examples of commercially available carboxylic silyl esters suitable as the isomer reducing agent are DOW CORNING® ETS 900 or XIAMETER® OFS-1579 Silane, available from Dow Corning Corporation of Midland, Mich. Another exemplary isomer reducing agent is 2,6,-Di-tert-butyl-4-(dimethylaminomethyl)phenol (DBAP).

The isomer reducing agent e), added in a sufficient amount ranging from 0.001 to 1 weight percent as noted above, promotes the alpha-addition of the SiH groups of the polyorganosiloxane (ii) to the aliphatically unsaturated group of the reactive species c) over the beta-addition of the SiH groups of the polyorganosiloxane (ii) to the aliphatically unsaturated group of the reactive species c). The beta-position addition may result in the subsequent further reaction of the polyorganosiloxane to generate Si—OH and associated silicon hydroxide product (sometimes referred to as D(Oz) and/or T(Oz) units). Without being bound by any theory, it is believed that the generation of Si—OH hastens condensation cure of the polyorganosiloxanes. The relative amount of D(Oz) units generated, which correlate to the amount of beta-position addition of SiH groups of the polyorganosiloxane (ii) to the aliphatically unsaturated group of the reactive species c), may be measured by NMR.

The clustered functional polyorganosiloxane produced in accordance with the present invention utilizing a sufficient amount of isomer reducing agent e) results in a reduction, and in certain embodiments at least a 10% reduction, in the amount of D(Oz) units present in the formed clustered functional polyorganosiloxane, as measured by NMR, which corresponds to a reduction, and in certain embodiments at least a 10% reduction, in the beta-addition of SiH groups of the polyorganosiloxane (ii) to the aliphatically unsaturated group of the reactive species c).

The components used in the process described above may optionally further comprise one or more additional components selected from f) a filler, g) a non-reactive resin, h) a chain extender, and i) an endcapper, or a combination thereof. Alternatively, the components used in the process may be components a), b), c) d), e) and f). Alternatively, the components used in the process may be components a), b), c), d), e), f) and h). Alternatively, the components used in the process may be components a), b), c) d), e), f) and i). Alternatively, the components used in the process may be components a), b), c), d), e), f), h) and i).

A filler f) may be added during the process of the first embodiment and the second embodiment as described above. Fillers are exemplified by reinforcing and/or extending fillers such as, alumina, calcium carbonate (e.g., fumed, ground, and/or precipitated), diatomaceous earth, quartz, silica (e.g., fumed, ground, and/or precipitated), talc, zinc oxide, chopped fiber such as chopped KEVLAR®, or a combination thereof. The amount of filler will depend on various factors including the type of filler selected and the end use of the clustered functional polyorganosiloxane to be produced by the process. However, the amount of filler may be up to 20%, alternatively 1% to 20%, based on the combined weight of all the components. When the clustered functional polyorganosiloxane prepared by the process described above will be used in an adhesive composition, the amount of filler may range from 10% to 20%. Alternatively, when the clustered functional polyorganosiloxane will be used in a sealant composition, the amount of filler may range from 4% to 10%.

Without wishing to be bound by theory, it is thought that when the filler is added during the process described herein, this will provide an improvement in tensile properties as compared to a prior art process in which a conventional ‘dumb-bell’ type polyorganosiloxane is formed in a multiple step process, and thereafter a filler is dispersed. Therefore, the process of the first embodiment described herein may further comprise: mixing component f), a filler, with component a) before or during step 1) of the process of the first embodiment described above. Alternatively, the process of the second embodiment may further comprise mixing f) a filler with component a) before or during step I) or mixing f) a filler with the components after step I) and before or during step II) of the process of the second embodiment described above.

The above process step of adding a filler in both the first embodiment and the second embodiment may provide a benefit with many curable groups, however, adverse reactions with clustered functional polyorganosiloxanes (for example, containing hydrolyzable groups) may still be problematic. To combat this problem, the process in the first embodiment may further comprise: mixing f) a filler and f′) a filler treating agent with component a) before or during step 1) of the process of the first embodiment described above. Alternatively, the process of the second embodiment may further comprise mixing f) a filler and f′) a filler treating agent with component a) before or during step I) or mixing f) a filler and f′) a filler treating agent with the components after step I) and before or during step II) of the process of the second embodiment described above. The effective treatment of filler surfaces in situ as described above may require elevated temperature and/or vacuum conditions. These conditions may also be undesirable with thermally sensitive unsaturated functional groups and their oxygen enabled antioxidants. Therefore, the filler may be pretreated with the filler treating agent in the presence of component a) at elevated temperature and/or under vacuum. These filler treating conditions may be performed in a batch or continuous process as described, for example, in U.S. Pat. No. 6,013,701 to Kunimatsu, et al.

The resulting combination of treated filler in polyorganosiloxane is referred to as a masterbatch. Masterbatches are commercially available. The use of masterbatches allows the smooth reaction of the aliphatically unsaturated organic groups of component a) with the silicon bonded hydrogen atoms of component b) and unsaturated organic groups of component c) to be performed in a single, low shear step; leading to filled clustered functional polyorganosiloxanes with superior tensile and adhesive properties along with improved rheological and storage properties.

A masterbatch comprising a polyorganosiloxane having aliphatically unsaturated organic groups and a treated filler, with optionally a second polyorganosiloxane (having aliphatically unsaturated organic groups) of the same or differing molecular weight may be combined with components b) and c), and the resulting mixture may be sheared before addition of component d) at room temperature (RT). Reaction may then be initiated by raising the temperature to 50° C. to 100° C., alternatively 70° C. to 85° C., and maintaining the temperature until all of the SiH has reacted, as measured by the time needed for the SiH peak as observed by Fourier Transform Infra Red spectroscopy (FT-IR) at about 2170 cm⁻¹, to be reduced into the background of the spectra.

Due to the thermal stability of the aliphatic ally unsaturated polyorganosiloxanes and filler treating agents, these processes of the first and second embodiment can be carried out at higher temperatures and shear, yielding stable, reproducible masterbatches of treated filler (such as silica) in aliphatically unsaturated polyorganosiloxane (polymer) such as vinyl endblocked PDMS. Not wanting to be constrained by theory, it is believed that exposing the polymer/filler interface to high temperature and shear, optimizes polymer/filler interactions and produces stable masterbatches. By using a masterbatch, one skilled in the art can formulate a curable silicone composition at low temperature and shear, which provides the benefit of making the process more widely applicable to prepare curable silicone compositions with different cure chemistries.

The filler treating agent f′) may be a treating agent, which is known in the art. The amount of filler treating agent may vary depending on various factors including the type and amounts of fillers selected for component f) whether the filler is treated with filler treating agent in situ or pretreated before being combined with component a). However, the components may comprise an amount ranging from 0.1% to 2% of filler treating agent, based on the weight of the filler for component f).

The filler treating agent f′) may comprise a silane such as an alkoxysilane, an alkoxy-functional oligosiloxane, a cyclic polyorganosiloxane, a hydroxyl-functional oligosiloxane such as a dimethyl siloxane or methyl phenyl siloxane, a stearate, or a fatty acid. The alkoxysilane may have the formula: R¹⁰ _(p)Si(OR¹¹)_((4-p)), where subscript p is 1, 2, or 3; alternatively p is 3. Each R¹⁰ is independently a monovalent organic group of 1 to 50 carbon atoms, such as a monovalent hydrocarbon group of 1 to 50 carbon atoms, alternatively 6 to 18 carbon atoms. Suitable monovalent hydrocarbon groups for R¹⁰ are exemplified by alkyl groups such as hexyl, octyl, dodecyl, tetradecyl, hexadecyl, and octadecyl; and aromatic groups such as benzyl, phenyl and phenylethyl. R¹⁰ can be a monovalent hydrocarbon group that is saturated or unsaturated and branched or unbranched. Alternatively, R¹⁰ can be a saturated, unbranched, monovalent hydrocarbon group. Each R¹¹ may be a saturated hydrocarbon group of 1 to 4 carbon atoms, alternatively 1 to 2 carbon atoms.

Alkoxysilane filler treating agents are exemplified by hexyltrimethoxysilane, octyltriethoxysilane, decyltrimethoxysilane, dodecyltrimethoxysilane, tetradecyltrimethoxysilane, phenyltrimethoxysilane, phenylethyltrimethoxysilane, octadecyltrimethoxysilane, octadecyltriethoxysilane, and a combination thereof.

Alkoxy-functional oligosiloxanes can also be used as filler treating agents f′). For example, suitable alkoxy-functional oligosiloxanes include those of the formula (R¹⁴O)_(q)Si(OSiR¹² ₂R¹³)_((4-q)). In this formula, subscript q is 1, 2, or 3, alternatively q is 3. Each R¹² can be independently selected from saturated and unsaturated monovalent hydrocarbon groups of 1 to 10 carbon atoms. Each R¹³ can be a saturated or unsaturated monovalent hydrocarbon group having at least 10 carbon atoms. Each R¹⁴ can be an alkyl group.

Alternatively, alkoxysilanes may be used, but typically in combination with silazanes, which catalyze the less reactive alkoxysilane reaction with surface hydroxyls. Such reactions are typically performed above 100° C. with high shear with the removal of volatile by-products such as ammonia, methanol and water.

Alternatively, the filler treating agent f′) can be any of the organosilicon compounds typically used to treat silica fillers. Examples of organosilicon compounds include, but are not limited to, organochlorosilanes such as methyltrichlorosilane, dimethyldichlorosilane, and trimethyl monochlorosilane; organosiloxanes such as hydroxy-endblocked dimethylsiloxane oligomer, hexamethyldisiloxane, and tetramethyldivinyldisiloxane; organosilazanes such as hexamethyldisilazane and hexamethylcyclotrisilazane; and organoalkoxysilanes such as methyltrimethoxysilane, C₆H₁₃Si(OCH₃)₃, C₈H₁₇Si(OC₂H₅)₃, C₁₀H₂₁Si(OCH₃)₃, C₁₂H₂₅Si(OCH₃)₃, C₁₄H₂₉Si(OC₂H₅)₃, and C₆H₅CH₂CH₂Si(OCH₃)₃, vinyltrimethoxysilane, vinyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-methacryloxypropyltrimethoxysilane.

Filler treating agents f′) for thermally conductive fillers, such as alumina or passivated aluminum nitride, may include alkoxysilyl functional alkylmethyl polysiloxanes (e.g., partial hydrolysis condensate of R²⁷ _(oo)R²⁸ _(pp)Si(OR²⁹)_((4-oo-pp)) or cohydrolysis condensates or mixtures), or similar materials where the hydrolyzable group may comprise silazane, acyloxy or oximo. In all of these, a group tethered to Si, such as R²⁷ in the formula above, is a long chain unsaturated monovalent hydrocarbon or monovalent aromatic-functional hydrocarbon. Each R²⁸ is independently a monovalent hydrocarbon group, and each R²⁹ is independently a monovalent hydrocarbon group of 1 to 4 carbon atoms. In the formula above, subscript oo is 1, 2, or 3 and subscript pp is 0, 1, or 2, with the proviso that a sum (oo+pp) is 1, 2, or 3.

Other filler treating agents include alkenyl functional polyorganosiloxanes. Suitable alkenyl functional polyorganosiloxanes include, but are not limited to:

where subscript qq has a value up to 1,500. Other filler treating agents include mono-endcapped alkoxy functional polydiorganosiloxanes, i.e., polydiorganosiloxanes having an alkoxy group at one end. Such filler treating agents are exemplified by the formula: R²⁵R²⁶ ₂SiO(R²⁶ ₂SiO)_(u), Si(OR²⁷)₃, where subscript u′ has a value of 0 to 100, alternatively 1 to 50, alternatively 1 to 10, and alternatively 3 to 6. Each R²⁵ is independently selected from an alkyl group, such as methyl, ethyl, propyl, butyl, hexyl, and octyl; and an alkenyl group, such as vinyl, allyl, butenyl, and Hex. Each R²⁶ is independently an alkyl group such as methyl, ethyl, propyl, butyl, hexyl, and octyl. Each R²⁷ is independently an alkyl group such as methyl, ethyl, propyl, and butyl. Alternatively, each R²⁵, each R²⁶, and each R²⁷ is methyl. Alternatively, each R²⁵ is vinyl. Alternatively, each R²⁶ and each R²⁷ is methyl.

Alternatively, a polyorganosiloxane capable of hydrogen bonding is useful as a treating agent. This strategy to treating the surface of a filler takes advantage of multiple hydrogen bonds, either clustered or dispersed or both, as the means to tether the compatibilization moiety to the filler surface. The polyorganosiloxane capable of hydrogen bonding has an average, per molecule, of at least one silicon-bonded group capable of hydrogen bonding. The group may be selected from: an organic group having multiple hydroxyl functionalities or an organic group having at least one amino functional group. The polyorganosiloxane capable of hydrogen bonding means that hydrogen bonding is the primary mode of attachment for the polyorganosiloxane to the filler. The polyorganosiloxane may be incapable of forming covalent bonds with the filler. The polyorganosiloxane capable of hydrogen bonding may be selected from the group consisting of a saccharide-siloxane polymer, an amino-functional polyorganosiloxane, and a combination thereof. Alternatively, the polyorganosiloxane capable of hydrogen bonding may be a saccharide-siloxane polymer.

The non-reactive silicone resin g) useful herein contains monofunctional units represented by R¹⁵ ₃SiO_(1/2) and tetrafunctional units represented by SiO_(4/2). R¹⁵ represents a nonfunctional monovalent organic group such as a hydrocarbon group. The silicone resin is soluble in liquid hydrocarbons such as benzene, toluene, xylene, heptane and the like or in liquid organosilicon compounds such as a low viscosity cyclic and linear polydiorganosiloxanes. The term “non-reactive”, as in a “non-reactive silicone resin g)”, is defined wherein the resin g) is non-bound in the curing matrix of the resultant clustered functional polyorganosiloxane of the present invention.

In the R¹⁵ ₃SiO_(1/2) unit, each R¹⁵ may independently be a monovalent hydrocarbon group containing up to 20 carbon atoms, alternatively 1 to 10 carbon atoms. Examples of suitable monovalent hydrocarbon groups for R¹⁵ include alkyl groups, such as methyl, ethyl, propyl, butyl pentyl, octyl, undecyl and octadecyl; cycloaliphatic radicals, such as cyclohexyl and cyclohexenylethyl; and aryl radicals such as phenyl, tolyl, xylyl, benzyl and 2-phenylethyl. Organic groups for R¹⁵ are exemplified by the hydrocarbon groups above modified such that where a non-reactive substituent has replaced a hydrogen atom, for example, the nonreactive substituent may include but are not limited to halogen and cyano. Typical organic groups that can be represented by R¹⁵ include but are not limited to chloromethyl and 3,3,3-trifluoropropyl.

The molar ratio of the R¹⁵ ₃SiO_(1/2) and SiO_(4/2) units in the non-reactive silicone resin g) may range from 0.5/1 to 1.5/1, alternatively from 0.6/1 to 0.9/1. These molar ratios are conveniently measured by Silicon 29 Nuclear Magnetic Spectroscopy (²⁹Si NMR). This technique is capable of quantitatively determining the concentration of R¹⁵ ₃SiO_(1/2) (“M”) and SiO_(4/2) (“Q”) units derived from the non-reactive silicone resin g), in addition to the total hydroxyl content of the non-reactive silicone resin g).

The non-reactive silicone resin g) may further comprise 2.0% or less, alternatively 0.7% or less, alternatively 0.3% or less, of terminal units represented by the formula XSiO_(3/2), where X represents hydroxyl or a hydrolyzable group exemplified by alkoxy such as methoxy and ethoxy. The concentration of hydrolyzable groups present in the non-reactive silicone resin g) can be determined using FT-IR.

The weight average molecular weight, M_(w), will depend at least in part on the molecular weight of the non-reactive silicone resin g) and the type(s) of hydrocarbon groups, represented by R¹⁵, that are present in this component. M_(w) as used herein represents the molecular weight measured using gel permeation chromatography (GPC), when the peak representing the neopentamer is excluded form the measurement. The M_(w) of the silicone resin may range from 12,000 to 30,000 g/mole (Dalton), typically 17,000 to 22,000 g/mole.

The non-reactive silicone resin g) can be prepared by any suitable method. Silicone resins of this type have been prepared by cohydrolysis of the corresponding silanes or by silica hydrosol capping methods known in the art. The silicone resin may be prepared by the silica hydrosol capping processes of Daudt, et al., U.S. Pat. No. 2,676,182; of Rivers-Farrell et al., U.S. Pat. No. 4,611,042; and of Butler, U.S. Pat. No. 4,774,310.

The intermediates used to prepare the non-reactive silicone resin g) are typically triorganosilanes of the formula R¹⁵ ₃SiX′, where X′ represents a hydrolyzable group, and either a silane with four hydrolyzable groups such as halogen, alkoxy or hydroxyl, or an alkali metal silicate such as sodium silicate.

It is desirable that the silicon-bonded hydroxyl groups (i.e., HOR¹⁵SiO_(1/2) or HOSiO_(3/2) groups) in the silicone resin be below 1.0% based on the total weight of the silicone resin, alternatively below 0.3%. Silicon-bonded hydroxyl groups formed during preparation of the silicone resin may be converted to trihydrocarbylsiloxy groups or a hydrolyzable group by reacting the silicone resin with a silane, disiloxane or disilazane containing the appropriate terminal group. Silanes containing hydrolyzable groups are typically added in excess of the quantity required to react with the silicon-bonded hydroxyl groups of the silicone resin.

Component h) is a chain extender. The chain extender may be a polydiorganosiloxane terminated at both ends with hydrogen atoms. An exemplary chain extender may have the formula (XVII): HR¹⁶ ₂Si—(R¹⁶ ₂SiO)_(r)—SiR¹⁶ ₂H, where each R¹⁶ is independently a monovalent hydrocarbon group exemplified by alkyl such as methyl, ethyl, propyl, butyl, pentyl, and hexyl; and aryl such as phenyl, tolyl, xylyl, and benzyl. Subscript r has an average value ranging from 0 to 400, alternatively 10 to 100.

Whether to use a chain extender, and the amount used when present, depends on various factors including the degree of crosslinking inherent in the system. For example, when starting with a polyorganosiloxane for component a) which has a relatively low average DP, e.g., average DP ranging from 60 to 400, then 50 mole % to 80 mole % of the SiH content in all of the components combined may come from the chain extender, alternatively 70 mole %. When using longer vinyl endblocked polymer (average DP>400) then lower levels are effective, e.g., 25 mole % to 50 mole % of SiH from chain extending molecules, preferably 40 mole %.

Component i) is an endcapper. The endcapper may be a polydiorganosiloxane having one silicon-bonded hydrogen atom per molecule. An exemplary endcapper may have the formula (XVIII), formula (XIX), or a combination thereof. Formula (XVIII) is R¹⁷ ₃SiO—(R¹⁷ ₂SiO)_(s)—SiR¹⁷ ₂H. Each R¹⁷ is independently a monovalent hydrocarbon group exemplified by alkyl such as methyl, ethyl, propyl, butyl, pentyl, and hexyl; and aryl such as phenyl, tolyl, xylyl and benzyl; and subscript s has a value ranging from 0 to 10, alternatively 1 to 10, and alternatively 1. Formula (XIX) is R¹⁸ ₃SiO—(R¹⁸ ₂SiO)_(t)—(HR¹⁸SiO)—SiR¹⁸ ₃. In this formula, each R¹⁸ is independently a monovalent hydrocarbon group exemplified by alkyl such as methyl, ethyl, propyl, butyl, pentyl, and hexyl; and aryl such as phenyl, tolyl, xylyl and benzyl. Subscript t has a value ranging from 0 to 10, alternatively 0.

Alternatively, one of a chain extender or an endcapper is used; i.e., in this instance, the chain extender and the endcapper are not in combination with each other.

The endcapper may provide the benefit of producing a looser network of higher tensile properties when used as a mole percentage of the available SiH in the system. The amount of endcapper added may range from 0 to 15%, alternatively 2% to 15%, and alternatively 10%, based on the combined weight of all components used in the process.

A secondary benefit of having a chain extender or an endcapper in the process is initial reduction in viscosity prior to reaction, which may facilitate the reaction and reduce the tendency for gelation due to insufficient mixing and local gel formation. Using a chain extender or an endcapper may be especially beneficial when using relatively high molecular weight polyorganosiloxanes for component a) (e.g., average DP greater than 400) and when a filler is present.

The weight percent of silicon bonded hydrogen atoms in the components/weight percent of unsaturated organic groups capable of undergoing hydrosilylation in the components (commonly referred to as SiH_(tot)/Vi_(tot) ratio) may range from 1/1.4 to 1/1, alternatively 1/1.2 to 1/1.1. In this ratio, SiH_(tot) refers to the amount of silicon bonded hydrogen atoms in component b) in combination with the amount of silicon bonded hydrogen atoms in components h) and/or i), if present. Vi_(tot) refers to the total amount of aliphatically unsaturated organic groups in components a) and c) combined.

Component j) is a catalyst inhibitor. Component j) may optionally be added after step 1) in the method of the first embodiment described above or after step II) in the method of the second embodiment of the process described above to stop the reaction and stabilize the clustered functional polyorganosiloxane prepared by the process described above. Some examples of suitable catalyst inhibitors include ethylenically or aromatically unsaturated amides, acetylenic compounds such as 2-ethynyl-isopropanol, 2-ethynyl-butane-2-ol, 2-methyl-3-butyn-2-ol, 2-phenyl-3-butyn-2-ol, 3,5-dimethyl-1-hexyn-3-ol, 1-ethynyl-1-cyclohexanol, 1,5-hexadiene, 1,6-heptadiene; 3,5-dimethyl-1-hexen-1-yne; 3-ethyl-3-buten-1-yne or 3-phenyl-3-buten-1-yne; ethylenically unsaturated isocyanates; silylated acetylenic alcohols exemplified by trimethyl (3,5-dimethyl-1-hexyn-3-oxy)silane, dimethyl-bis-(3-methyl-1-butyn-oxy)silane, methylvinylbis(3-methyl-1-butyn-3-oxy)silane, and ((1,1-dimethyl-2-propynyl)oxy)trimethylsilane; unsaturated hydrocarbon diesters; conjugated ene-ynes exemplified by 2-isobutyl-1-butene-3-yne, 3,5-dimethyl-3-hexene-1-yne, 3-methyl-3-pentene-1-yne, 3-methyl-3-hexene-1-yne, 1-ethynylcyclohexene, 3-ethyl-3-butene-1-yne, and 3-phenyl-3-butene-1-yne; olefinic siloxanes such as 1,3-divinyltetramethyldisiloxane, 1,3,5,7-tetravinyltetramethyl cyclotetrasiloxane, or 1,3-divinyl-1,3-diphenyldimethyldisiloxane; 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane; a mixture of a conjugated ene-yne as described above and an olefinic siloxane as described above; hydroperoxides; nitriles and diaziridines; unsaturated carboxylic esters exemplified by diallyl maleate, dimethyl maleate, diethyl fumarate, diallyl fumarate, and bis-2-methoxy-1-methylethylmaleate, mono-octylmaleate, mono-isooctylmaleate, mono-allyl maleate, mono-methyl maleate, mono-ethyl fumarate, mono-allyl fumarate, and 2-methoxy-1-methylethylmaleate; fumarates such as diethylfumarate; fumarate/alcohol mixtures wherein the alcohol is benzyl alcohol or 1-octanol and ethenyl cyclohexyl-1-ol; a nitrogen-containing compound such as tributylamine, tetramethylethylenediamine, benzotriazole; a similar phosphorus-containing compound such as triphenylphosphine; a sulphur-containing compound; a hydroperoxy compound; or a combination thereof.

The inhibitors are used in an amount effective to deactivate component d) the hydrosilylation catalyst. The amount will vary depending on the type and amount of catalyst and the type of inhibitor selected, however, the amount may range from 0.001 to 3 parts by weight, and alternatively from 0.01 to 1 part by weight per 100 parts by weight of component a).

The process described above produces a clustered functional polyorganosiloxane, or masterbatch of clustered functional polyorganosiloxane and filler and/or non-reactive silicone resin, as the reaction product. Collectively, the clustered functional polyorganosiloxane and the masterbatch of clustered functional polyorganosiloxane and filler and/or non-reactive silicone resin may be referred to herein as a clustered functional product. This clustered functional product is useful for formulation into curable silicone compositions such as adhesives and sealants. The curing mechanism of the curable silicone composition depends on the curable groups imparted to component the clustered functional product by component c) described above, and the other components added to the composition, described below. The curing mechanism may be, for example, a heat curing mechanism such as thermal radical initiation; a room temperature curing mechanism such as organoborane initiation (when an amine reactive compound is added instead of heat) or redox reaction or radiation curing; or a combination thereof.

The curable silicone composition comprises:

(I) a clustered functional product prepared by the process described above, and

(II) a curing agent.

The selection of curing agent (II) will depend on the type and amount of curable groups (supplied by component c) in component (I). For example, because component (I) has radical curable groups, such as acrylate or methacrylate groups, the curing agent (II) may comprise a radical initiator such as a thermal radical initiator or a room temperature radical initiator.

Thermal radical initiators include, but are not limited to, dicumyl peroxide, n-butyl 4,4′-bis(butylperoxy)valerate, 1,1-bis(t-butylperoxy)-3,3,5 trimethyl cyclohexane, di-t-butyl peroxide and 2,5-di-(t-butylperoxy)-2,5 dimethyl hexane, 1,1-bis(tert-amylperoxy)cyclohexane (Luperox® 531M80); 2,2-bis(tert-butylperoxy)butane; 2,4-pentanedione peroxide (Luperox® 224), 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane (Luperox® 101), 2,5-di(tert-butylperoxy)-2,5-dimethyl-3-hexyne; 2-butanone peroxide, benzoyl peroxide, cumene hydroperoxide, di-tert-amyl peroxide (Luperox® DTA®), lauroyl peroxide (Luperox® LP), tert-butyl hydroperoxide; tert-butyl peracetate; tert-butyl peroxybenzoate; tert-butylperoxy 2-ethylhexyl carbonate; di(2,4-dichlorobenzoyl) peroxide; dichlorobenzoylperoxide (available as Varox® DCBP from R. T. Vanderbilt Company, Inc. of Norwalk, Conn., USA); di(tert-butylperoxyisopropyl)benzene, di(4-methylbenzoyl) peroxide, butyl 4,4-di(tert-butylperoxy)valerate, 3,3,5,7,7-pentamethyl-1,2,4-trioxepane; tert-butyl peroxy-3,5,5-trimethylhexanoate; tert-butyl cumyl peroxide; di(4-tert-butylcyclohexyl) peroxydicarbonate (available as Perkadox 16); dicetyl peroxydicarbonate; dimyristyl peroxydicarbonate; 2,3-dimethyl-2,3-diphenylbutane, dioctanoyl peroxide; tert-butylperoxy 2-ethylhexyl carbonate; tert-amyl peroxy-2-ethylhexanoate, tert-amyl peroxypivalate; and combinations thereof.

Examples of such thermal radical initiators are commercially available under the following trade names: Luperox® sold by Arkema, Inc. of Philadelphia, Pa., U.S.A.; Trigonox and Perkadox sold by Akzo Nobel Polymer Chemicals LLC of Chicago, Ill., U.S.A., VAZO sold by E.I. duPont de Nemours and Co. of Wilmington, Del., USA; VAROX® sold by R.T. Vanderbilt Company, Inc. of Norwalk, Conn., U.S.A.; and Norox sold by Syrgis Performance Initiators, Inc. of Helena, Ark., U.S.A. The concentration of the thermal radical initiator may range from 0.01% to 15%, alternatively from 0.1% to 5%, and alternatively 0.1% to 2%, based on the weight of the composition.

Alternatively, the curing agent may comprise a room temperature radical initiator such as an organoborane-amine complex. The organoborane amine complex is a complex formed between an organoborane and a suitable amine compound that renders the complex stable at ambient conditions. The complex should be capable of initiating polymerization or crosslinking of component (I) by the introduction of an amine reactive compound and/or by heating. An example is an alkylborane amine complex formed from trialkylboranes and various amine compounds. While the preferred molar ratio can vary, the optimal molar ratio may range from 1 to 10 nitrogen groups per B atom where B represents boron. Examples of trialkylboranes useful for forming the curing agent include trialkylboranes of the formula B—R″₃ where R″ represents linear and branched aliphatic or aromatic hydrocarbon groups containing 1 to 20 carbon atoms. Some examples include trimethylborane, tri-n-butylborane, tri-n-octylborane, tri-sec-butylborane, tridodecylborane, and phenyldiethylborane.

Some examples of amine compounds useful to form the organoborane amine complex with the organoborane compounds include 1,3 propane diamine, 1,6-hexanediamine, methoxypropylamine, pyridine, and isophorone diamine. Other examples of amine compounds useful to form organoborane amine complexes are described in U.S. Pat. No. 6,777,512 (the '512 patent), as well as in U.S. Pat. No. 6,806,330.

Silicon containing amine compounds can also be used to form the organoborane amine complex including compositions such as 3-aminopropyltrimethoxysilane, aminomethyltrimethoxysilane, 3-aminopropyltriethoxysilane, aminomethyltriethoxysilane, 2-(trimethoxysilylethyl)pyridine, aminopropylsilanetriol, 3-(m-aminophenoxy)propyltrimethoxysilane, 3-aminopropyldiisopropylmethoxysilane, aminophenyltrimethoxysilane, 3-aminopropyltris(methoxyethoxethoxy)silane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, N-(2-aminoethyl)aminomethyltrimethoxysilane, N-(6-aminohexyl)aminomethyltrimethoxysilane, N-(2-aminoethyl)-11-aminoundecyltrimethoxysilane, (aminoethylaminomethyl)phenethyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminoisobutylmethyldimethoxysilane, and (3-trimethoxysilylpropyl)diethylene-triamine.

Amine functional polyorganosiloxanes are also useful for forming the organoborane amine complex including amine functional polydiorganosiloxanes, and amine functional polyorganosiloxane resins. This is subject to the stipulation that the molecule contain at least one amine-functional group, such as 3-aminopropyl, 2-aminoethyl, aminomethyl, 6-aminohexyl, 11-aminoundecyl, 3-(N-allylamino)propyl, N-(2-aminoethyl)-3-aminopropyl, N-(2-aminoethyl)-3-aminoisobutyl, p-aminophenyl, 2-ethylpyridine, and 3-propylpyrrole.

Specific examples include terminal and/or pendant amine-functional polydimethylsiloxane oligomers and polymers, terminal and/or pendant amine-functional random, graft and block copolymers and co-oligomers of polydimethylsiloxane and poly(3,3,3 trifluoropropyl-methylsiloxane), terminal and/or pendant amine-functional random, graft and block copolymers and co-oligomers of polydimethylsiloxane and poly(6,6,6,5,5,4,4,3,3-nonfluorohexyl-methylsiloxane), and terminal and/or pendant amine-functional random, graft and block copolymers and co-oligomers of polydimethylsiloxane and polyphenylmethylsiloxane.

Also useful to form the organoborane amine complex are other nitrogen containing compounds including N-(3-triethyoxysilylpropyl)-4,5-dihydroimidazole, ureidopropyltriethoxysilane, nitrogen containing polyorganosiloxanes, and polyorganosiloxane resins in which at least one group is an imidazole, amidine, or ureido functional group. When the amine compound is polymeric, the molecular weight is not limited, except that it should be such as to maintain a sufficiently high concentration of boron to permit curing or polymerization of the composition. For example, in a two-part composition, the part containing the organoborane initiator may be diluted with other components of the composition, or it may consist of the initiator complex alone.

When an organoborane amine complex is used as the curing agent, the curable silicone composition may further comprise an amine reactive compound that is capable of initiating the polymerization or crosslinking of the composition when mixed with the organoborane amine complex and exposed to an oxygenated environment. The presence of the amine reactive compound allows the initiation of polymerization or crosslinking to occur at temperatures below the dissociation temperature of the organoborane amine complex including room temperature and below. To achieve storage stability in the presence of oxygen, the organoborane amine complex and the amine reactive compound may be physically or chemically isolated. For example, a composition containing an amine reactive compound can be rendered air stable by packaging it separately from the organoborane amine complex as a multiple-part composition. Alternatively, the organoborane amine complex, the amine reactive compound, or both can be encapsulated, or delivered in separate phases. This can be accomplished by introducing one or both of the organoborane amine complex, the amine reactive compound in a solid form that prevents intimate mixing of the organoborane amine complex, the amine reactive compound. Curing of the composition can be activated by (a) heating it above the softening temperature of the solid phase component or encapsulant, or (b) by introduction of a solubilizing agent that allows mixing of the organoborane amine complex, the amine reactive compound. The organoborane amine complex, the amine reactive compound can also be combined in a single container without significant polymerization or crosslinking by packaging the two components in a container where mixing conditions are anaerobic.

Examples of some amine reactive compounds having amine reactive groups that can rapidly initiate polymerization or cure in the presence of oxygen include mineral acids, Lewis acids, carboxylic acids, carboxylic acid derivatives such as anhydrides and succinates, carboxylic acid metal salts, isocyanates, aldehydes, epoxides, acid chlorides, and sulphonyl chlorides. Some suitable amine reactive compounds include acrylic acid, polyacrylic acid, methacrylic acid, polymethacrylic acid, methacrylic anhydride, polymethacrylic anhydride, undecylenic acid, oleic acid, isophorone diisocyanate, methacryloylisocyanate, 2-(methacryloyloxy)ethyl acetoacetate, undecylenic aldehyde, and dodecyl succinic anhydride.

For improved compatibility in curable silicone compositions the amine reactive compound may be an organosilane or organopolysiloxane bearing amine reactive groups. Some examples include 3-isocyanatopropyltrimethoxysilane; isocyanatomethyltrimethoxysilane; 3-glycidoxypropyltrimethoxysilane; triethoxysilylpropyl succinic anhydride; propylsuccinic anhydride functionalized linear, branched, resinous, and hyperbranched organopolysiloxanes; methylsuccinic anhydride functionalized linear, branched, resinous, and hyperbranched organopolysiloxanes; cyclohexenyl anhydride functional linear, resinous, and hyperbranched organopolysiloxanes; carboxylic acid functionalized linear, branched, resinous, and hyperbranched organopolysiloxanes such as carboxydecyl terminated oligomeric or polymeric polydimethylsiloxanes; and aldehyde functionalized linear, branched, resinous, and hyperbranched organopolysiloxanes such as undecylenic aldehyde-terminated oligomeric or polymeric polydimethylsiloxanes. The '512 patent describes silicon containing compounds that can be used including certain compounds that release an acid when exposed to moisture. The '512 patent also describes other amine reactive compounds referred to as decomplexation agents. Alternatively, the decomplexation agent may be selected from acids, anhydrides, isocaynates, or epoxies. Specific examples include 3-(triethoxysilyl)propylsuccinicanhydride, nonenyl succinic anhydride, acetic acid, 2-carboxyethylacrylate, ethylene glycol methacrylate phosphate, and acrylic acid.

Alternatively, the room temperature radical initiator comprises a redox reagent as an initiator for radical polymerization. The reagent may be a combination of a peroxide and an amine or a transition metal chelate. The redox reagent is exemplified by, but not limited to, diacyl peroxides such as benzoyl peroxide and acetyl peroxide; hydroperoxides such as cumene hydroperoxide and t-butyl hydroperoxide; ketone peroxides such as methyl ethyl ketone peroxide and cyclohexanone peroxide; dialkyl peroxides such as dicumyl peroxide and ti-t-butyl peroxide; peroxy esters such as t-butyl peroxy acetate; and combinations of thioglycerol and pyrazoles and/or pyrazolones. Alternatively, the redox reagent may be exemplified by dimethylaniline, 3,5-dimethylpyrazole, thioglycerol; and combinations thereof. Examples of suitable redox reagent initiatiors are known in the art and are exemplified as in U.S. Pat. No. 5,459,206. Other suitable peroxides are known in the art and are commercially available such as lauroyl peroxide (Luperox® LP from Arkema), dichlorobenzoylperoxide (Varox® DCBP from R. T. Vanderbilt Company, Inc.) and 6N tert-butyl hydroperoxide.

The curable silicone composition may optionally further comprise one or more additional components. The additional components are exemplified by (III) a solvent, (IV) an adhesion promoter, (V) a colorant, (VI) a reactive diluent, (VII) a corrosion inhibitor, (VIII) a polymerization inhibitor, and a combination thereof. The curable silicone composition may optionally further comprise (IX) a filler, (X) a filler treating agent, (XI) an acid acceptor; and a combination thereof, for example, if a filler has not been added during the process for making the clustered functional polyorganosiloxane, or if more or a different filler is desired to formulate, e.g., the filler to be added is a thermally conductive filler, described below.

Component (III) is a solvent. Suitable solvents are exemplified by organic solvents such as toluene, xylene, acetone, methylethylketone, methyl isobutyl ketone, hexane, heptane, alcohols such as decyl alcohol or undecyl alcohol, and a combination thereof; and non-crosslinkable silicone solvents such as trimethylsiloxy-terminated polydimethylsiloxanes, trimethylsiloxy-terminated polymethylphenylsiloxanes, and a combination thereof. Examples of silicone solvents are known in the art and are commercially available, for example, as DOW CORNING® OS Fluids from Dow Corning Corporation of Midland, Mich., U.S.A. The amount of component (III) may range from 0.001% to 90% based on the weight of the curable silicone composition.

Component (IV) is an adhesion promoter. Examples of suitable adhesion promoters include an alkoxysilane such as an epoxy-functional alkoxysilane, or a mercapto-functional compound; a combination of an alkoxysilane and a hydroxy-functional polyorganosiloxane; a mercapto-functional compound; an unsaturated compound; an epoxy-functional silane; an epoxy-functional siloxane; a combination, such as a reaction product, of an epoxy-functional silane or epoxy-functional siloxane and a hydroxy-functional polyorganosiloxane; or a combination thereof. Suitable adhesion promoters are known in the art and are commercially available. For example, Silquest® A186 is beta-(3,4-epoxycyclohexyl)ethyltrimethoxysilane which is commercially available from Crompton OSi Specialties of Middlebury, Conn., USA. CD9050 is a monofunctional acid ester useful as an adhesion promoter that provides adhesion to metal substrates and is designed for radiation curable compositions. CD9050 is commercially available from Sartomer Co. SR489D is tridecyl acrylate, SR395 is isodecyl acrylate, SR257 is stearyl acrylate, SR506 is isobomyl acrylate, SR833S is tricyclodecane dimethanol diacrylate, SR238 is 1,6 hexanediol diacrylate, and SR351 is trimethylol propane triacrylate, all of which are also commercially available from Sartomer Co. The amount of adhesion promoter (IV) added to the composition depends on various factors including the specific adhesion promoter selected, the other components of the composition, and the end use of the composition, however, the amount may range from 0.1% to 5% based on the weight of the composition. Other suitable adhesion promoters, which are useful to promote adhesion to metals, include maleic anhydride, methacrylic anhydride, and glycidyl methacrylate.

Component (IV) can be an unsaturated or epoxy-functional compound. Suitable epoxy-functional compounds are known in the art and commercially available, see for example, U.S. Pat. Nos. 4,087,585; 5,194,649; 5,248,715; and 5,744,507 (at col. 4-5). Component (g) may comprise an unsaturated or epoxy-functional alkoxysilane. For example, the functional alkoxysilane can have the formula R²⁰ _(v)Si(OR²¹)_((4-v)), where subscript v is 1, 2, or 3, alternatively v is 1.

Each R²⁰ is independently a monovalent organic group with the proviso that at least one R²⁰ is an unsaturated organic group or an epoxy-functional organic group. Epoxy-functional organic groups for R²⁰ are exemplified by 3-glycidoxypropyl and (epoxycyclohexyl)ethyl. Unsaturated organic groups for R²⁰ are exemplified by 3-methacryloyloxypropyl, 3-acryloyloxypropyl, and unsaturated monovalent hydrocarbon groups such as vinyl, allyl, hexenyl, undecylenyl.

Each R²¹ is independently an unsubstituted, saturated hydrocarbon group of 1 to 4 carbon atoms, alternatively 1 to 2 carbon atoms. R²¹ is exemplified by methyl, ethyl, propyl, and butyl.

Examples of suitable epoxy-functional alkoxysilanes include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, (epoxycyclohexyl)ethyldimethoxysilane, (epoxycyclohexyl)ethyldiethoxysilane and combinations thereof. Examples of suitable unsaturated alkoxysilanes include vinyltrimethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, hexenyltrimethoxysilane, undecylenyltrimethoxysilane, 3-methacryloyloxypropyl trimethoxysilane, 3-methacryloyloxypropyl triethoxysilane, 3-acryloyloxypropyl trimethoxysilane, 3-acryloyloxypropyl triethoxysilane, and combinations thereof. Alternatively, examples of suitable adhesion promoters include glycidoxypropyltrimethoxysilane and a combination of glycidoxypropyltrimethoxysilane with an aluminum chelate or zirconium chelate.

Component (IV) may comprise an epoxy-functional siloxane such as a reaction product of a hydroxy-terminated polyorganosiloxane with an epoxy-functional alkoxysilane, as described above, or a physical blend of the hydroxy-terminated polyorganosiloxane with the epoxy-functional alkoxysilane. Component (IV) may comprise a combination of an epoxy-functional alkoxysilane and an epoxy-functional siloxane. For example, component (IV) is exemplified by a mixture of 3-glycidoxypropyltrimethoxysilane and a reaction product of hydroxy-terminated methylvinylsiloxane with 3-glycidoxypropyltrimethoxysilane, or a mixture of 3-glycidoxypropyltrimethoxysilane and a hydroxy-terminated methylvinylsiloxane, or a mixture of 3-glycidoxypropyltrimethoxysilane and a hydroxy-terminated methylvinyl/dimethylsiloxane copolymer. When used as a physical blend rather than as a reaction product, these components may be stored separately in multiple-part kits.

Suitable mercapto-functional compounds include an organomercaptan, a mercapto containing silane, or a combination thereof. Suitable mercapto containing silanes include 3-mercaptopropyltrimethoxysilane. Suitable mercapto-functional compounds are disclosed in U.S. Pat. No. 4,962,076. One skilled in the art would recognize that certain components described herein may be added to the composition for more than one or different purposes. For example, alkoxysilanes may be use as adhesion promoters, filler treating agents, and/or as crosslinking agents in condensation reaction curable silicone compositions.

Component (V) is a colorant (e.g., dye or pigment). Examples of suitable colorants include carbon black, Stan-Tone 40SP03 Blue (which is commercially available from PolyOne) and Colorant BA33 Iron Oxide pigment (which is commercially available from Cathay Pigments (USA), Inc. Valparaiso, Ind. 46383 USA). Examples of colorants are known in the art and are disclosed in U.S. Pat. Nos. 4,962,076; 5,051,455; and 5,053,442. The amount of colorant added to the curable silicone composition depends on various factors including the other components of the composition, and the type of colorant selected, however, the amount may range from 0.001% to 20% based on the weight of the composition.

Component (VI) is a reactive diluent. Component (VI) may be diluent that reacts with a functional group on component (I). The reactive diluent may be a monofunctional reactive diluent, a difunctional reactive diluent, a polyfunctional reactive diluent, or a combination thereof. The reactive diluent selected will depend on various factors including the curable groups on component (I). However, examples of suitable reactive diluents include an acrylate, an anhydride such as a maleic anhydride or methacrylic anhydride, an epoxy such as a monofunctional epoxy compound, a methacrylate such as glycidyl methacrylate, an oxetane, a vinyl acetate, a vinyl ester, a vinyl ether, a fluoro alkyl vinyl ether, a vinyl pyrrolidone such as N-vinyl pyrrolidone, a styrene, or a combination thereof.

Mono-functional acrylate and methacrylate esters are commercially available from companies such as Sartomer, Rohm Haas, Hitachi Chemical, Arkema, Inc., Cytec, Sans Ester Corp, Rahn, and Bomar Specialties Co. Specific examples include methyl acrylate; methyl methacrylate; ethyl acrylate; ethyl methacrylate; butyl acrylate; butyl methacrylate; cyclohexyl acrylate; hexyl acrylate; 2-ethylhexyl acrylate; isodecyl methacrylate; isobornyl methacrylate; hydroxyethyl methacrylate; hydroxypropyl acrylate; hydroxypropyl methacrylate; n-octyl acrylate; cyclohexyl methacrylate; hexyl methacrylate; 2-ethylhexyl methacrylate; decyl methacrylate; dodecyl methacrylate; lauryl acrylate; tert-butyl methacrylate; acrylamide; N-methyl acrylamide; diacetone acrylamide; N-tert-butyl acrylamide; N-tert-octyl acrylamide; N-butoxyacrylamide; gamma-methacryloxypropyl trimethoxysilane; dicyclopentadienyloxyethyl methacrylate; 2-cyanoethyl acrylate; 3-cyanopropyl acrylate; tetrahydrofurfuryl methacrylate; tetrahydrofurfuryl acrylate; glycidyl acrylate; acrylic acid; methacrylic acid; itaconic acid; glycidyl methacrylate; 1,12 dodecanediol dimethacrylate; 1,3-butylene glycol diacrylate; 1,3-butylene glycol dimethacrylate; 1,3-butylene glycol dimethacrylate; 1,4-butanediol diacrylate; 1,4-butanediol dimethacrylate; 1,4-butanediol dimethacrylate; 1,6 hexanediol diacrylate; 1,6 hexanediol dimethacrylate; alkoxylated cyclohexane dimethanol diacrylate; alkoxylated hexanediol diacrylate; alkoxylated neopentyl glycol diacrylate; cyclohexane dimethanol diacrylate; cyclohexane dimethanol dimethacrylate; diethylene glycol diacrylate; diethylene glycol dimethacrylate; dipropylene glycol diacrylate; ethoxylated bisphenol a diacrylate; ethoxylated bisphenol a dimethacrylate; ethylene glycol dimethacrylate; neopentyl glycol diacrylate; neopentyl glycol dimethacrylate; polypropylene glycoldimethacrylate; propoxylated neopentyl glycol diacrylate; propoxylated neopentyl glycol diacrylate; tricyclodecane dimethanol diacrylate; triethylene glycol diacrylate; trimethylolpropane triacrylate; trimethylolpropane trimethacrylate; tris (2-hydroxy ethyl) isocyanurate triacrylate; tris (2-hydroxy ethyl) isocyanurate triacrylate; n,n′-m-phenylenedimaleimide; triallyl cyanurate; triallyl isocyanurate; metallic diacrylate; metallic dimethacrylate; metallic monomethacrylate; metallic diacrylate (difunctional); metallic dimethacrylate (difunctional); triethoxysilylpropyl methacrylate; tributoxysilylpropyl methacrylate; dimethoxymethylsilylpropyl methacrylate; diethoxymethylsilylpropyl methacrylate; dibutoxymethylsilylpropyl methacrylate; diisopropoxymethylsilylpropyl methacrylate; dimethoxysilylpropyl methacrylate; diethoxysilylpropyl methacrylate; dibutoxysilylpropyl methacrylate; diisopropoxysilylpropyl methacrylate; trimethoxysilylpropyl acrylate; triethoxysilylpropyl acrylate; tributoxysilylpropyl acrylate; dimethoxymethylsilylpropyl acrylate; diethoxymethylsilylpropyl acrylate; dibutoxymethylsilylpropyl acrylate; diisopropoxymethylsilylpropyl acrylate; dimethoxysilylpropyl acrylate; diethoxysilylpropyl acrylate; dibutoxysilylpropyl acrylate; and diisopropoxysilylpropyl acrylate.

Examples of suitable vinyl ethers include, but are not limited to butanediol divinyl ether, cyclohexanedimethanol divinyl ether, cyclohexanedimethanol monovinyl ether, cyclohexyl vinyl ether, diethyleneglycol divinyl ether, diethyleneglycol monovinyl ether, dodecyl vinyl ether, ethyl vinyl ether, hydroxybutyl vinyl ether, isobutyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, n-propyl vinyl ether, octadecyl vinyl ether, triethyleneglycol divinyl ether, and combinations thereof. Vinyl ethers are known in the art and commercially available from BASF AG of Germany, Europe. The amount of component (VI) depends on various factors such as the specific reactive diluent selected, but the amount may range from 0.5 to 50% based on the weight of curable silicone composition. One skilled in the art would recognize that some of the reactive diluents described herein (such as the difunctional and polyfunctional acrylates and methacrylates) may also be used in addition to, or instead of, the reactive species described above as component c).

Component (VII) is a corrosion inhibitor. Examples of suitable corrosion inhibitors include benzotriazole, mercaptabenzotriazole, mercaptobenzothiazole, and commercially available corrosion inhibitors such as 2,5-dimercapto-1,3,4-thiadiazole derivative (CUVAN® 826) and alkylthiadiazole (CUVAN® 484) from R. T. Vanderbilt. The amount of component (VII) may range from 0.05% to 0.5% based on the weight of the curable silicone composition.

Component (VIII) is a polymerization inhibitor. Examples of suitable polymerization inhibitors for acrylate and methacrylate curable groups include, but are not limited to: 2,6,-Di-tert-butyl-4-(dimethylaminomethyl)phenol (DBAP), hydroquinone (HQ); 4-methoxyphenol (MEHQ); 4-ethoxyphenol; 4-propoxyphenol; 4-butoxyphenol; 4-heptoxyphenol; butylated hydroxytoluene (BHT); hydroquinone monobenzylether; 1,2-dihydroxybenzene; 2-methoxyphenol; 2,5-dichlorohydroquinone; 2,5-di-tert-butylhydroquinone; 2-acetylhydroquinone; hydroquinone monobenzoate; 1,4-dimercaptobenzene; 1,2-dimercaptobenzene; 2,3,5-trimethylhydroquinone; 4-aminophenol; 2-aminophenol; 2-N, N-dimethylaminophenol; 2-mercaptophenol; 4-mercaptophenol; catechol monobutylether; 4-ethylaminophenol; 2,3-dihydroxyacetophenone; pyrogallol-1,2-dimethylether; 2-methylthiophenol; t-butyl catechol; di-tert-butylnitroxide; di-tert-amylnitroxide; 2,2,6,6-tetramethyl-piperidinyloxy; 4-hydroxy-2,2,6,6-tetramethyl-piperidinyloxy; 4-oxo-2,2,6,6-tetramethyl-piperidinyloxy; 4-dimethylamino-2,2,6,6-tetramethyl-piperidinyloxy; 4-amino-2,2,6,6-tetramethyl-piperidinyloxy; 4-ethanoloxy-2,2,6,6-tetramethyl-piperidinyloxy; 2,2,5,5-tetramethyl-pyrrolidinyloxy; 3-amino-2,2,5,5-tetramethyl-pyrrolidinyloxy; 2,2,5,5-tetramethyl-1-oxa-3-azacyclopentyl-3-oxy; 2,2,5,5-tetramethyl-3-pyrrolinyl-1-oxy-3-carboxylic acid; 2,2,3,3,5,5,6,6-octamethyl-1,4-diazacyclohexyl-1,4-dioxy; salts of 4-nitrosophenolate; 2-nitrosophenol; 4-nitrosophenol; copper dimethyldithiocarbamate; copper diethyldithiocarbamate; copper dibutyldithiocarbamate; copper salicylate; methylene blue; iron; phenothiazine (PTZ); 3-oxophenothiazine; 5-oxophenothiazine; phenothiazine dimer; 1,4-benzenediamine; N-(1,4-dimethylpentyl)-N′-phenyl-1,4-benzenediamine; N-(1,3-dimethylbutyl)-N′-phenyl-1,4-benzenediamine; N-nitrosophenylhydroxylamine and salts thereof; nitric oxide; nitrobenzene; p-benzoquinone; pentaerythrityl tetrakis(3-laurylthiopropionate); dilauryl thiodipropionate; distearyll thiodipropionate; ditridecyl thiodipropionate; tetrakis[methylene 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]methane; thiodiethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]; octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate; isotridecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate; N,N′-hexamethyl (3,5-di-tertbutyl-4-hydroxyhydrocinnamamide); iso-octyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate; 2,2′-ethylidenebis-(4,6-di-tert-butylphenol); 1,3,5-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxybenzyl) benzene; 4,6-bis(octylthiomethyl)-o-cresol; triethylene glycol-bis-3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate; tris-(3,5-di-tert-butylhydroxybenzyl) isocyanurate; tris(2,4-di-tert-butylphenyl) phosphate; distearyl pentaerythritol diphosphite; bis(2,4-di-tert-butyl phenyl)pentaerythritol diphosphite; 2,5-di-tert-amyl-hydroquinone; or isomers thereof; combinations of two or more thereof; or combinations of one or more of the above with molecular oxygen. When present, the polymerization inhibitor may be added to the curable silicone composition in an amount ranging from 100 ppm to 4,000 ppm. Polymerization inhibitors are known in the art and are disclosed, for example in EP 1 359 137.

Component (IX) is a filler that may be added if a filler f) was not used in the process for making the clustered functional polyorganosiloxane, or if additional filler or a different type of filler is desired, such as a thermally conductive filler. The filler may be a filler described above as component f). Alternatively, the filler (IX) may be a thermally conductive filler.

The thermally conductive filler may be both thermally conductive and electrically conductive. Alternatively, the thermally conductive filler may be thermally conductive and electrically insulating. The thermally conductive filler may be selected from the group consisting of aluminum nitride, aluminum oxide, aluminum trihydrate, barium titanate, beryllium oxide, boron nitride, carbon fibers, diamond, graphite, magnesium hydroxide, magnesium oxide, metal particulate, onyx, silicon carbide, tungsten carbide, zinc oxide, and a combination thereof. The thermally conductive filler may comprise a metallic filler, an inorganic filler, a meltable filler, or a combination thereof. Metallic fillers include particles of metals and particles of metals having layers on the surfaces of the particles. These layers may be, for example, metal nitride layers or metal oxide layers on the surfaces of the particles. Suitable metallic fillers are exemplified by particles of metals selected from the group consisting of aluminum, copper, gold, nickel, silver, and combinations thereof, and alternatively aluminum. Suitable metallic fillers are further exemplified by particles of the metals listed above having layers on their surfaces selected from the group consisting of aluminum nitride, aluminum oxide, copper oxide, nickel oxide, silver oxide, and combinations thereof. For example, the metallic filler may comprise aluminum particles having aluminum oxide layers on their surfaces.

Inorganic fillers are exemplified by onyx; aluminum trihydrate, metal oxides such as aluminum oxide, beryllium oxide, magnesium oxide, and zinc oxide; nitrides such as aluminum nitride and boron nitride; carbides such as silicon carbide and tungsten carbide; and combinations thereof. Alternatively, inorganic fillers are exemplified by aluminum oxide, zinc oxide, and combinations thereof. Meltable fillers may comprise Bi, Ga, In, Sn, or an alloy thereof. The meltable filler may optionally further comprise Ag, Au, Cd, Cu, Pb, Sb, Zn, or a combination thereof. Examples of suitable meltable fillers include Ga, In—Bi—Sn alloys, Sn—In—Zn alloys, Sn—In—Ag alloys, Sn—Ag—Bi alloys, Sn—Bi—Cu—Ag alloys, Sn—Ag—Cu—Sb alloys, Sn—Ag—Cu alloys, Sn—Ag alloys, Sn—Ag—Cu—Zn alloys, and combinations thereof. The meltable filler may have a melting point ranging from 50° C. to 250° C., alternatively 150° C. to 225° C. The meltable filler may be a eutectic alloy, a non-eutectic alloy, or a pure metal. Meltable fillers are commercially available.

For example, meltable fillers may be obtained from Indium Corporation of America, Utica, N.Y., U.S.A.; Arconium, Providence, R.I., U.S.A.; and AIM Solder, Cranston, R.I., U.S.A. Aluminum fillers are commercially available, for example, from Toyal America, Inc. of Naperville, Ill., U.S.A. and Valimet Inc., of Stockton, Calif., U.S.A. Silver filler is commercially available from Metalor Technologies U.S.A. Corp. of Attleboro, Mass., U.S.A.

Thermally conductive fillers are known in the art and commercially available, see for example, U.S. Pat. No. 6,169,142 (col. 4, lines 7-33). For example, CB-A20S and Al-43-Me are aluminum oxide fillers of differing particle sizes commercially available from Showa-Denko, and AA-04, AA-2, and AA18 are aluminum oxide fillers commercially available from Sumitomo Chemical Company Zinc oxides, such as zinc oxides having trademarks KADOX® and XX®, are commercially available from Zinc Corporation of America of Monaca, Pa., U.S.A.

The shape of the thermally conductive filler particles is not specifically restricted, however, rounded or spherical particles may prevent viscosity increase to an undesirable level upon high loading of the thermally conductive filler in the composition.

The thermally conductive filler may be a single thermally conductive filler or a combination of two or more thermally conductive fillers that differ in at least one property such as particle shape, average particle size, particle size distribution, and type of filler. For example, it may be desirable to use a combination of inorganic fillers, such as a first aluminum oxide having a larger average particle size and a second aluminum oxide having a smaller average particle size. Alternatively, it may be desirable, for example, use a combination of an aluminum oxide having a larger average particle size with a zinc oxide having a smaller average particle size. Alternatively, it may be desirable to use combinations of metallic fillers, such as a first aluminum having a larger average particle size and a second aluminum having a smaller average particle size. Alternatively, it may be desirable to use combinations of metallic and inorganic fillers, such as a combination of aluminum and aluminum oxide fillers; a combination of aluminum and zinc oxide fillers; or a combination of aluminum, aluminum oxide, and zinc oxide fillers. Use of a first filler having a larger average particle size and a second filler having a smaller average particle size than the first filler may improve packing efficiency, may reduce viscosity, and may enhance heat transfer.

The average particle size of the thermally conductive filler will depend on various factors including the type of thermally conductive filler selected and the exact amount added to the curable silicone composition, as well as the bondline thickness of the device in which the cured product of the composition will be used when the cured product will be used as a thermal interface material (TIM). However, the thermally conductive filler may have an average particle size ranging from 0.1 micrometer to 80 micrometers, alternatively 0.1 micrometer to 50 micrometers, and alternatively 0.1 micrometer to 10 micrometers.

The amount of the thermally conductive filler in the composition depends on various factors including the cure mechanism selected for the curable silicone composition and the specific thermally conductive filler selected. However, the amount of the thermally conductive filler may range from 30 vol % to 80 vol %, alternatively 50 vol % to 75 vol % by volume of the composition. Without wishing to be bound by theory, it is thought that when the amount of filler is greater than 80 vol %, the composition may crosslink to form a cured silicone with insufficient dimensional integrity for some applications, and when the amount of filler is less than 30%, the cured silicone prepared from the composition may have insufficient thermal conductivity for TIM applications.

Component (X) is a filler treating agent. The filler treating agent may be a filler treating agent f′) described above as the filler treating agent for component f). Alternatively, metal fillers can be treated with alkylthiols such as octadecyl mercaptan and others, and fatty acids such as oleic acid, stearic acid, titanates, titanate coupling agents, zirconate coupling agents, and a combination thereof.

Filler treating agents for alumina or passivated aluminum nitride may include alkoxysilyl functional alkylmethyl polysiloxanes (e.g., partial hydrolysis condensate of R²² _(w)R²³ _(x)Si(OR²⁴)_((4-w-x)) or cohydrolysis condensates or mixtures), or similar materials where the hydrolyzable group may comprise silazane, acyloxy or oximo. In all of these, a group tethered to Si, such as R²² in the formula above, is a long chain unsaturated monovalent hydrocarbon or monovalent aromatic-functional hydrocarbon. Each R²³ is independently a monovalent hydrocarbon group, and each R²⁴ is independently a monovalent hydrocarbon group of 1 to 4 carbon atoms. In the formula above, subscript w is 1, 2, or 3 and subscript x is 0, 1, or 2, with the proviso that the sum (w+x) is 1, 2, or 3. One skilled in the art would recognize that the alkoxysilanes and mercapto-functional compounds described as adhesion promoters for component (IV) may alternatively be used, in addition to or instead of, filler treating agents for component (X). One skilled in the art could optimize a specific treatment to aid dispersion of the filler without undue experimentation.

Component (XI) is an acid acceptor. The acid acceptor may comprise a metal oxide such as magnesium oxide. Acid acceptors are known in the art and are commercially available under tradenames including Rhenofit F, Star Mag CX-50, Star Mag CX-150, BLP-3, and MaxOx98LR. Rhenofit F was calcium oxide from Rhein Chemie Corporation of Chardon, Ohio, USA. Star Mag CX-50 was magnesium oxide from Merrand International Corp. of Portsmouth, N.H., USA. MagOX 98LR was magnesium oxide from Premier Chemicals LLC of W. Conshohocken, Pa., USA. BLP-3 was calcium carbonate was Omya Americas of Cincinnati, Ohio, USA.

One skilled in the art would be able to select appropriate curing agents and additional components to formulate compositions for sealants and adhesives based on the description above and the examples provided herein.

The curable silicone composition described above may be used in various applications, for example, sealant applications such as forming a lid seal (e.g., automotive lid seal or microelectronics lid seal), forming an adhesive (such as a die attach adhesive or thermally conductive adhesives), or forming a terminal sealant.

The curable silicone composition described above, and a cured silicone prepared by curing the composition, are useful in electronics applications, including both microelectronics and macroelectronics applications as well as optoelectronics applications and thermally conductive electronics applications, such as making thermally conductive adhesives. Cured silicone adhesives prepared from such a curable silicone composition may adhere to various electronics substrates, including metals such as aluminum, copper, and electroless nickel; as well as polymeric substrates such as FR4, Nylon, polycarbonate, Lucite (which is polymethylmethacrylate, PMMA), polybutylene terephthalate (PBT), and Solvay liquid crystal polymers.

EXAMPLES

These examples are intended to illustrate the invention to one of ordinary skill in the art and should not be interpreted as limiting the scope of the invention set forth in the claims.

NMR:

Solution-state ²⁹Si- and ¹³C-NMR spectra were recorded on a Mercury VX 400 MHz spectrometer at room temperature (20-22° C.) using CDCl3 (Isotec) in a 16 mm Si-free probe. Cr(acac)₃ (Chromium acetylacetonoate) (20 mM) was added to NMR samples as a relaxation agent. ²⁹Si NMR spectra were acquired at 79.493 MHz and processed with 5 Hz of Lorentzian line broadening. The spectra were only semiquantitative due to the long relaxation times of the ²⁹Si nucleus, but relative comparison of spectra acquired under identical conditions was considered quantitative. ¹³C NMR spectra were acquired at 100.626 MHz and processed with 3 Hz of Lorentzian line broadening. For both nuclei, 256-512 scans with a 90° pulse width were typically co-added to achieve adequate sensitivity; a 6-second (²⁹Si) or 12-second (13C) delay between pulses was used. Gated decoupling was used to remove negative nuclear Overhauser effects. Chemical shifts were referenced to external tetramethylsilane (TMS).

I. Impact of Isomer Reducing Agent on Clustered Functional Polyorganosiloxane

A. Variation in Amount of Added Isomer Reducing Agent on Generation of T(Oz) and D(Oz) Units

In a dry 3-neck flask, 100 g DOW CORNING® SFD-119 (dimethylvinyl-terminated dimethyl siloxane), 6.2 g cyclic methylhydrogensiloxane, 14 g allyl methacrylate (AMA), 0.2 g butylated hydroxytoluene (BHT) and varying amounts of an isomer reducing agent (either OFS-1579, available from Dow Corning Corporation of Midland, Mich., or DBAP (2,6-Di-tert-butyl-4-(dimethylaminomethyl)phenol) were added and mixed under a nitrogen blanket. 0.12 g of a platinum catalyst (DOW CORNING® 2-0707) was added and the mixture was mixed for an additional 5 minutes. The mixture was then heated to 60° C. for 1 hour. The reaction was monitored by the reduction in the SiH peak at 2173 cm⁻¹ by IR spectroscopy. The mixture was cooled to room temperature and diallyl maleate (DAM) was added. The reaction mixture was analyzed by ²⁹Si NMR for the presence of T(Oz) and D(Oz) units. The results are summarized in Tables 1 and 2 below and indicate that the introduction of at least 100 ppm of an isomer reducing agent in the formulation (either OFS-1579 or DBAP) reduced the level of T(Oz) and D(Oz) units by at least 10%, which corresponds to at least a 10% reduction in the beta-addition of SiH groups of the methylhydrogensiloxane to the allyl methacrylate.

TABLE 1 OFS-1579 (ppm) 0 100 200 500 1000 T(OZ) 0.46 0.39 0.43 0.29 0.27 D(OZ) 1.81 1.42 1.38 1.49 1.36 % Decrease in Isomer 0 20.3 20.3 21.6 28.2

TABLE 2 DBAP (ppm) 0 100 200 500 1000 T(OZ) 0.46 0.34 0.37 0.16 0.27 D(OZ) 1.81 1.68 1.65 1.59 1.6 % Decrease in Isomer 0 11.0 11.0 22.9 17.6

B. Viscosity Comparison of Samples with and without Isomer Reducing Agent (Samples 1 and 2)

In a 10 liter Turello mixer, 5000 g of DOW CORNING® SFD117, 196.34 g of cyclic methylhydrogensiloxane, 467.76 g of AMA and 1.13 g of BHT were added and mixed for 15 minutes. 5.45 g of platinum catalyst was added and the mixture was mixed for a further 15 minutes at room temperature. The mixture was heated to 80° C. for 1 hour, wherein samples were evaluated by IR for the disappearance of SIH signal. At 1 hour the mixture was cool to less than 45° C. wherein 11.33 g of DAM was added. The vacuum was set to 55 mmHg and the temperature was increased to 80° C. and the mixture was stripped for 30 minutes. The resultant composition (Sample 1) was cooled to less than 30° before packaging.

In a 10 liter Turello mixer 5000 g of DOW CORNING® SFD117, 196.34 g of cyclic methylhydrogensiloxane, 467.76 g of AMA, 1.13 g of BHT and 1.13 g of OFS-1579 were added and mixed for 15 minutes. 5.45 g of platinum catalyst was added and the mixture was mixed for a further 15 minutes at room temperature. The mixture was heated to 80° C. for 1 hour, wherein samples were evaluated by IR for the disappearance of SIH signal. At 1 hour the mixture was cool to less than 45° C. wherein 11.33 g of DAM was added. The vacuum was set to 55 mmHg and the temperature was increased to 80° C. and the mixture was stripped for 30 minutes. The resultant composition (Sample 2) was cooled to less than 30° C. before packaging.

Samples 1 and 2 were measured for viscosity (in centipoises (cps) using a Brookfield LVF viscometer at 3 revolutions per minute using a #3 spindle. The results, as shown in Table 3, that the introduction of the isomer reducing agent (Sample 2) provided a relatively stable viscosity over a 194 day period, while the viscosity of the corresponding example (Sample 1) without the isomer reducing agent increased to almost double the viscosity after 127 days and to the point of gellation after 194 days.

TABLE 3 Days of aging Initial 127 194 Sample 2 9200 9600 9600 Sample 1 6800 11600 Gelled II. Evaluation of Physical Properties of Adhesive Composition A. Preparation of Methacrylate Clustered Silicone Polymers with (MCP-1) and without (MCP) Isomer Reducing Agent.

In a 50 liter Turello mixer 12 kg of a silicone polymer masterbatch (MB2030) (SFD-128/silica blend), 6.77 kg of DOW CORNING® SFD-120 polymer, 1.12 kg of DOW CORNING® OS20 silicone fluid (methylsiloxane fluid available from Dow Corning Corporation of Midland, Mich.) and 20.45 g of OFS-1579 isomer reducing agent were loaded. The mixture was inerted using 2% oxygen in nitrogen atmosphere and stirred for 15 minutes. To this homogenized mixture was added 6 g of BHT, 409.7 g of cyclic methylhydrogensiloxane, and 965.3 g of AMA. The resultant mixture was stirred for an additional 20 minutes at room temperature, at which point 26.62 g of a platinum catalyst was added and the mixture. The mixture was stirred for 10 additional minutes before setting the temperature at 60° C. The temperature was held for 30 minutes at 60° C. before cooling to greater than 40° C. and adding 26.62 g of DAM. The mixture was then cooled to less than 35° C. before adding 182.8 g of methyltrimethoxysilane (MTM). The mixture was then heated to 60° C. and held for 30 minutes, wherein the temperature was increased to 80° C. and a vacuum of 55 mm Hg was applied for 40 minutes. The resultant polymer is hereinafter referred to as MCP-1.

For producing the MCP resin without an isomer reducing agent, the same procedure was followed as in the previous paragraph with the exception of the addition of 20.45 g of OFS-1579 isomer reducing agent.

B. Synthesis Alkoxylated Resin Polymer Blend (ARPB-1)

To a 10 kg Turello mixer a resin polymer blend (RPB) was added along with magnesium oxide, and iron pigment BA33 and blended for 15 minutes under a nitrogen blanket. To this mixer a mixture of methyltrimethoxysilane (DOW CORNING® Z6070) and hexamethyldisilazane (DOW CORNING® 4-2839) was added. The mixture was blended for 15 minutes prior to steam heating the material to 60-80° C. The temperature was held at 60° C. for 30 minutes. The temperature was increased to 120° C. and a fully vacuum of less than 50 torr was applied for 60 minutes. The mixture was cooled to less than 40° C. prior to the addition of an alkoxylating agent (ethyltrimethoxysilane (ETM) polymer—DOW CORNING® XCF3-6105) and endcapper (Bis H DOW CORNING® 2-5161). After 15 minutes of mixing a platinum catalyst was added with a further 15 minutes of mixing prior to heating the mixture to a temperature of 75-90° C. The SiH/CH₃ ratio was monitored by IR until completion of the reaction within 20 minutes. The material was devolatilized by heating to 125° C. with full vacuum of 55 mm Hg for 30 minutes.

C. Preparation of Adhesives and Adhesive Testing

Adhesive compositions were prepared by cold blending the methacrylate clustered silicone polymer with and without an isomer reducing agent (i.e., MCP-1 and MCP, respectively) with ARPB-1 and with addition promoter packages and radical initiators as provided in Table 4 below. The resultant adhesive compositions were then evaluated for viscosity at 1 day, 7 days and 14 days as shown in Table 5.

TABLE 4 MCP or MCP-1 71.75 ARBP-1 19.34 RBM-9020 Modifier¹ 2.95 OFS-6030 Silane² 1.97 TAIC³ 0.49 TYZOR TNBT⁴ 0.62 A-1110⁵ 0.1 A186⁶ 0.6 2- 0.15 Mercaptobenzothiazole⁷ OFS-2306 Silane⁸ 1.96 OFS-1719 Silane⁹ 0.1 TINOPAL OB¹⁰ 0.02 ¹T-catalyst available from Dow Coming Corporation of Midland, Michigan. ²Methacryloxypropyltrimethoxysilane available from Dow Corning Corporation of Midland, Michigan. ³Triallylisocyanurate available from Nippon Kasei Chemical Company Limited. ⁴Epoxy functional silane available from Silquest. ⁵γ-Aminopropyltriethoxysilane available from Silquest. ⁶n-Butyl titanate available from DuPont ™. ⁷Available from Sigma-Aldrich. ⁸Isobutyltrimethoxysilane available from Dow Corning Corporation of Midland, Michigan. ⁹Vinyldimethylchlorosilane available from Dow Corning Corporation of Midland, Michigan. ¹⁰2,5-thiophenediylbis(5-tert-butyl-1,3-benzoxazole), commercially available from Ciba.

TABLE 5 Viscosity (1s⁻¹) % Change in Viscosity Days Aged Room after 14 Temperature 1 7 14 days Table 3 Adhesive 341.07 457.26 670.03 96.45 with MCP Table 3 Adhesive 297.48 393.81 418.10 40.55 with MCP-1

As Table 5 confirms, the introduction of the isomer reducing agent to the adhesive formulation resulted in a significant reduction in the viscosity increase of the adhesive after 14 days of aging.

Next, the adhesives were applied to Alclad™ aluminum substrates (available from Alcoa) and cured for 20 minutes at 85° C. and having 8 mil bond line thickness. One half of the samples were evaluated at room temperature and aged, while the remaining samples were placed in a pressure cooker tester (PCT) for 24 hours at 1 additional atmosphere and evaluated after aging. The lap shear adhesive properties of the coated substrates appropriately aged were evaluated for peak stress, in pounds per square inch (PSI), with the results summarized in Table 6.

TABLE 6 Peak Stress (PSI) Dry Adhesion PCT Initial Week2 Week1 Week2 Table 3 Adhesive 431.16 400.51 513.01 527.18 with MCP Table 3 Adhesive 495.94 424.66 563.12 533.39 with MCP-1

As Table 6 confirms, the introduction of an isomer reducing agent to the adhesive composition resulted in comparable adhesion to Alclad™ aluminum substrates as compared with samples that did not include the isomer reducing agent.

D. Comparison of Physical Properties of Adhesive with MCP-1 Versus Commercially Available Adhesives on a Wide Variety of Substrates

Next, Adhesive MCP-1 was compared with various commercially available adhesive compositions (DOW CORNING® 866, 3-6265, 3-6265 HP, and 7091), which are known to have excellent adhesion to a variety of both metal and plastic substrates. The incumbent one part silicone adhesive used in industrial processes generally use one of two cure processes. A heat activated Pt catalyzed addition chemistry that utilizes silicone hydride based crosslinkers with silicone vinyl polymers is utilized by DOW CORNING® 866, 3-6265, and 3-6265 HP. DOW CORNING® 7091 utilizes a condensation cure in which alkoxy silicone polymers equivalent to those utilized in ARPB which are triggered by exposure to moisture in the atmosphere.

The addition cured systems cure rapidly but take elevated temperature to develop adhesion (greater than 120° C. and typically 150° C.). These Pt based systems are known to be inhibited by numerous plastic substrates especially those containing basic substituents like polyamides and epoxies. The elevated temperatures also lead to water physisorbed on the surface of plastics and metals to devolatilize. The devolatilization during the curing process can lead to bubbling and voiding issues. This is believed to be a combination of liquid water devolatilization and interaction of the water/SiH moieties in the presence of the platinum catalyst. The condensation curable adhesive develops adhesion at room temperature to a wider variety of substrate but adhesion typically takes days to weeks to fully develop.

Sample Preparation on Alclad™ Panels:

1″×3″ Al Alclad™ Panels were cleaned with acetone (3 samples prepared). Bondlines were established using Spheriglass spacer beads (Potters Industries Inc. 350 North Baker Drive, Canby, Oreg. 97013-0607) appropriate with the application (i.e, 8 mil (200 micron)). Larger bond lines used 20 mil wire.

A ⅜″ binder clip was used with both spacers methods to secure substrates during cure. Cure at time and temperature were specified in results below. Testing was carried out on Instron 5566 tensiometer at 2 inches per minute (Instron Worldwide Headquarters, 825 University Ave., Norwood, Mass. 02062-2643) The results are summarized in Table 7 and 8 below:

TABLE 7 Product # DOW DOW DOW CORNING ® Table 3 CORNING ® CORNING ® 3-6265 DOW Adhesive 866 3-6265 HP CORNING ® with MCP-1 Curing Pt Pt Pt 7091 Radical/ Mechanism Addition Addition Addition Condensation Condensation Durometer, 57 60 67 37 36 Shore A Tensile 925 700 815 400 420 Strength, psi Elongation, % 210 165 145 590 285 Modulus, 440 425 560 70 135 100%, psi Lap shear to 725 610 800 430 400 Alclad ™ Al, psi Viscosity 54,000 970,000 1,140,000 low shear Viscosity 49000 230,000 300,000 high shear Specific 1.3 1.34 1.33 1.42 1.09 Gravity Typical 30 min 20 min 20 min 3 days @25° C. 20 min cure, time at @150° C., @150° C., @150° C., @85° C., bond line 60 min 45 min 45 min 1-2 min temp @125° C. @125° C. @125° C. @>100° C.

As Table 7 confirms, the adhesive composition (Table 3 Adhesive with MCP-1) according to the present invention exhibited adequate physical properties in terms of Durometer hardness, tensile strength, elongation, modulus and lap shear on Alclad™ Al substrates. In addition, the adhesive composition (Table 3 Adhesive with MCP-1) according to the present invention cured at lower temperatures (actual cure condition or bond line cure condition) than platinum catalyzed addition chemistry adhesive systems and in substantially shorter time periods than condensation curable adhesive systems.

Sample preparation on a Wide Variety of Metal and Plastic Substrates:

1″×3″ panels of the various substrates were cleaned with acetone (3 samples prepared). Bondlines were established using Spheriglass spacer beads (Potters Industries Inc. 350 North Baker Drive, Canby, Oreg. 97013-0607) appropriate with the application (i.e, 8 mil (200 micron)). Larger bond lines used 20 mil wire.

A ⅜″ binder clip was used with both spacers methods to secure substrates during cure. Cure at time and temperature were specified in results below. Testing was carried out on Instron 5566 tensiometer at 2 inches per minute (Instron Worldwide Headquarters, 825 University Ave., Norwood, Mass. 02062-2643).8:

TABLE 8 DOW DOW DOW Table 3 CORNING ® CORNING ® 3- CORNING ® 3- Adhesive 866 6265 6265 HP with MCP-1 PSI % CF PSI % CF PSI % CF PSI % CF Alclad ™ Al¹¹ 12 10% 20 100% 20 20% 40 100% (Peel) 3105 PBT¹² (lap 538 100 476 100 617 100 300 100% shear) 3105 PBT (peel) 18 70 16 100 16 100 50 100% LCP¹³ (lap 107 0 0 0 100 0 290 100% shear) PA66¹⁴ (peel) 16 90 12 100 10 50 34 100% PC¹⁵ (peel) 0 0 0 0 0 0 95 100% PE¹⁶ (peel) 0 0 0 0 0 0 12  50% FR-4¹⁷ (lap 355 100 477 100 658 100 308 100% shear) FR-4 (peel) 12 100 20 100 22 100 44 100% ¹¹Alclad Aluminum, Type AD Q-Panel 2024T3 from Q-Lab Corporation, 800., Cleveland, OH 44145 USA. ¹²3105 PBT: Polybutylene terephthalate Celanex ® 3105 available from Ticona North America, Florence, KY 41042. ¹³LCP: liquid crystal polymer, Xydar ® available from Solvay Chemicals, Houston, Texas 77098 USA. ¹⁴PA66: Polyamide Ultramid ® available at BASF Corporation, Florham Park, NJ 07932 USA. ¹⁵PC: Polycarbonate Lexan ® available from, SABIC Innovative Plastics Pittsfield, MA 01201, USA. ¹⁶PE: Polyethylene Medium High Density PE (PEX), available at Lowes, Mooresville, NC 28117 USA. ¹⁷FR-4: Epoxy glass fiber laminates available from Norplex-Micarta, Postville, Iowa, USA.

As Table 8 illustrates, the adhesive composition (Table 3 Adhesive with MCP-1) according to the present invention exhibited adequate adhesion and cohesion to both aluminum and plastic substrates and was the only adhesive composition to adhere to polyethylene.

Table 9 below shows the impact on cure system of voiding caused by moisture on surface of certain plastic substrates, here Ticona Celanex® 3300D PBT and BASF polyamide PA66.

TABLE 9 Product # DOW DOW DOW Table 3 Water CORNING ® CORNING ® CORNING ® Adhesive Content 3-6265 3-6265HP 7091 with MCP-1 Ticona 0.20% few bubbles no bubbling sig bubbling no bubbling Celanex ® 0.33% sig bubbling few bubbles sig bubbling no bubbling 3300D PBT BASF 1.50% sig bubbling some sig bubbling no bubbling polyamide bubbles PA66 1.90% sig bubbling sig bubbling sig bubbling no bubbling 2.65% sig bubbling sig bubbling sig bubbling sig bubbling

As Table 9 illustrates, the adhesive composition (Table 3 Adhesive with MCP-1) according to the present invention experienced no bubbling on either substrate at any of the provided water content levels.

E. Evaluation of Clustered Functional Polyorganosiloxane with Alternative Radical Initiators

Using the process cited above but replacing RBM-9020 modifier a dichlorobenzoylperoxide based initiator with Perkadox L-50-PS and higher temperature benzoyl peroxide based initiator (See Table 6), higher temperature curing materials were evaluated over four different substrates (Polybutyl Terephthalate (PBT), Polyphenyl Sulphone (PPS), Alclad™ aluminum substrates (AL), and aluminum die cast metal (ADC)) under different curing conditions.

TABLE 10 MCP-1 72.54 ARBP-1 19.55 Perkadox L-50S-PS¹¹ 1.88 OFS-6030 Silane² 1.99 TAIC³ 0.49 TYZOR TNBT⁴ 0.62 A-1110⁵ 0.1 A186⁶ 0.6 2-Mercaptobenzothiazole⁷ 0.15 OFS-2306 Silane⁸ 1.96 OFS-1719 Silane⁹ 0.1 TINOPAL OB¹⁰ 0.02 ¹¹Dibenzoyl peroxide available from Akzo-Nobel

TABLE 11A Cure Temp Time PBT PPS method (deg C) (mins) N/cm² CF % N/cm² CF % Press 120 2 220 100 205 100 4 218 100 228 100 6 207 100 243 100 Oven 120 4 129 100 148 100 10 175 100 171 100 100 20 173 100 201 100 30 180 100 185 100 % CF = percentage cohesive failure

TABLE 11B Cure Temp Time AL ADC method (deg C) (mins) N/cm² CF % N/cm² CF % Press 120 2 182 100 202 100 4 201 100 235 100 6 248 100 213 100 Oven 120 4 242 100 205 100 10 260 100 225 100 100 20 216 100 252 100 30 213 100 274 100 % CF = percentage cohesive failure

The results from Tables 11A and 11B confirm that adhesive compositions formed with the clustered functional polyorganosiloxane of the present invention including the isomer reducing agent but utilizing an alternative radical initiator exhibited good performance over a wide variety of metal and plastic substrates and under varying curing conditions.

The introduction of an isomer reducing agent during the process for forming the clustered functional polyorganosiloxane in accordance with the present invention increases the storage stability and bath life of the resultant clustered functional polyorganosiloxane by promoting the alpha-addition of the SiH groups of the polyorganosiloxane (ii) to the aliphatically unsaturated group of the reactive species c) over the beta-addition of the SiH groups of the polyorganosiloxane (ii) to the aliphatically unsaturated group of the reactive species c), wherein the beta-position addition may result in the subsequent further reaction of the polyorganosiloxane to generate Si—OH and associated silicon hydroxide product (sometimes referred to as D(Oz) and/or T(Oz) units). Without being bound by any theory, it is believed that the generation of Si—OH hastens condensation cure of the polyorganosiloxanes.

A curable adhesive composition containing the clustered functional polyorganosiloxane may provide the advantage of being self-adhesive (i.e., forming adhesion to the substrates above, when unprimed), even when cured at relatively low temperature (e.g., 80° C. or less). The curable silicone composition may further provide the benefit of relatively fast tack free time for electronics industry applications, as compared to curable silicone compositions that do not contain the clustered curable polymer prepared by the process described above.

The instant disclosure has been described in an illustrative manner, and it is to be understood that the terminology which has been used is intended to be in the nature of words of description rather than of limitation. Many modifications and variations of the instant disclosure are possible in light of the above teachings. It is, therefore, to be understood that within the scope of the appended claims, the instant disclosure may be practiced otherwise than as specifically described. 

The invention claimed is:
 1. A clustered functional polyorganosiloxane comprising a reaction product of a reaction of: a) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups, b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and c) a reactive species having, per molecule, at least one aliphatically unsaturated organic group and one or more radical curable groups comprising acrylate groups, methacrylate groups, or combinations thereof; in the presence of d) a hydrosilylation catalyst and e) an isomer reducing agent; with the proviso that a weight percent of silicon bonded hydrogen atoms in component b)/weight percent of aliphatically unsaturated organic groups in component a) (the SiHb/Via ratio) ranges from 4/1 to 20/1 and the reaction product prepared by the process has more than one curable group at each molecular terminal of the polyorganosiloxane of component a); wherein the isomer reducing agent e) is added in an amount based on the total weight of the clustered functional polyorganosiloxane to produce at least a 10% reduction in the beta-addition of SiH groups of the polyorganosiloxane to the aliphatically unsaturated group of the reactive species c) in the clustered functional polyorganosiloxane reaction product as compared to a clustered functional polyorganosiloxane formed as the reaction product of components a), b) and c) in the presence of d) but in the absence of the isomer reducing agent e); wherein the isomer reducing agent e) comprises one or more carboxylic silyl esters or 2,6-Di-tert-butyl-4-(dimethylaminomethyl)phenol; and wherein the isomer reducing agent e) is added in an amount of 0.001 to 1 weight percent, based on the total weight of the clustered functional polyorganosilxoane.
 2. The clustered functional polyorganosiloxane as set forth in claim 1 wherein the isomer reducing agent e) comprises one or more carboxylic silyl esters.
 3. The clustered functional polyorganosiloxane as set forth in claim 1 wherein the isomer reducing agent e) comprises 2,6-Di-tert-butyl-4-(dimethylaminomethyl)phenol.
 4. A curable silicone composition comprising: (I) a clustered functional polyorganosiloxane comprising a reaction product of a reaction of: a) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups, b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule, and c) a reactive species having, per molecule at least one aliphatically unsaturated organic group and one or more radical curable groups comprising acrylate groups, methacrylate groups or combination thereof, in the presence of d) a hydrosilylation catalyst and e) an isomer reducing agent; with the proviso that a weight percent of silicon bonded hydrogen atoms in component b)/weight percent of aliphatically unsaturated organic groups in component a) (the SiHb/Via ratio) Page 3 of 11 wherein the isomer reducing agent e) is added in an amount based on the total weight of the clustered functional polyorganosiloxane to produce at least a 10% reduction in the beta-addition of SiH groups of the polyorganosiloxane a) to the aliphatically unsaturated group of the reactive species c) as compared to a clustered functional polyorganosiloxane formed in the absence of the isomer reducing agent e); and (II) a curing agent; and an iron oxide pigment.
 5. The composition as set forth in claim 4, where the composition is radiation curable, and the curing agent (II) comprises a radical initiator.
 6. The composition as set forth in claim 4, wherein the composition is thermal curable wherein the curing agent (II) comprises a thermal radical initiator, or wherein the composition is curable at room temperature wherein the curing agent (II) comprises an organoborane, or wherein the composition is curable via a redox reaction.
 7. A process for producing a clustered functional polyorganosiloxane comprising: 1) concurrently reacting components comprising a) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups, b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule, c) a reactive species having, per molecule at least one aliphatically unsaturated organic group and one or more radical curable groups comprising acrylate groups, methacrylate groups, or combinations thereof; in the presence of d) a hydrosilylation catalyst and e) an isomer reducing agent; with the proviso that a weight percent of silicon bonded hydrogen atoms in component b)/weight percent of aliphatically unsaturated organic groups in component a) (the SiH_(b)/Vi_(a) ratio) ranges from 4/1 to 20/1 and the reaction product prepared by the process has more than one curable group at each molecular terminal of the polyorganosiloxane of component a), wherein the isomer reducing agent e) is added in an amount based on the total weight of the clustered functional polyorganosiloxane to produce at least a 10% reduction in the beta-addition of SiH groups of the polyorganosiloxane a) to the aliphatically unsaturated group of the reactive species c) as compared to a clustered functional polyorganosiloxane formed in the absence of the isomer reducing agent e); wherein the isomer reducing agent e) comprises one or more carboxylic silyl esters or 2,6-Di-tert-butyl-4-(dimethylaminomethyl)phenol, and wherein the isomer reducing agent e) is added in an amount of 0.001 to 1 weight percent, based on the total weight of the clustered functional polyorganosilxoane.
 8. A process for producing a clustered functional polyorganosiloxane comprising: 1) concurrently reacting components comprising a) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups, and b) a polyorganohydrogensiloxane having an average, per molecule, of 4 to 15 silicon atoms and at least 4 silicon bonded hydrogen atoms per aliphatically unsaturated organic group in component a) (the SiH_(b)/Vi_(a) ratio), where component b) is present in an amount sufficient to provide 1 molecule of component b) per each aliphatically unsaturated organic group of component a), in the presence of d) a hydrosilylation catalyst to form a product; and thereafter 2) reacting the product of step 1) with a component comprising: c) a reactive species having, per molecule at least one aliphatically unsaturated organic group and 1 or more radical curable groups comprising acrylate groups, methacrylate groups or combinations thereof, in the presence of e) an isomer reducing agent; with the proviso that a weight percent of silicon bonded hydrogen atoms in component b)/weight percent of aliphatically unsaturated organic groups in component a) ranges from 4/1 to 20/1 and the reaction product prepared by the process has more than one curable group at each molecular terminal of the polyorganosiloxane a), wherein the isomer reducing agent e) is added in an amount based on the total weight of the clustered functional polyorganosiloxane to produce at least a 10% reduction in the beta-addition of SiH groups of the polyorganosiloxane a) to the aliphatically unsaturated group of the reactive species c) as compared to a clustered functional polyorganosiloxane formed in the absence of the isomer reducing agent e); wherein the isomer reducing agent e) comprises one or more carboxylic silyl esters or 2,6-Di-tert-butyl-4-(dimethylaminomethyl)phenol and wherein the isomer reducing agent e) is added in an amount of 0.001 to 1 weight percent, based on the total weight of the clustered functional polyorganosilxoane.
 9. The process of claim 7 further comprising step 3) adding a catalyst inhibitor and optionally step 4) purifying the product of step 2).
 10. The process of claim 8, where the components in step 1) further comprise a masterbatch, wherein the masterbatch is formed prior to step 1) and comprises a filler mixed with all or a portion of the polyorganosiloxane a).
 11. The process of claim 8, where the components in step 1) further comprise a masterbatch, wherein the masterbatch is formed prior to step 1) and comprises a filler mixed with a filler treating agent and all or a portion of the polyorganosiloxane a).
 12. The process of claim 7, where reactive species c) comprises an organic compound having an average, per molecule, of 1 to 2 alkenyl or alkynyl groups, and one or more reactive groups comprising an acrylate group, a methacrylate group, or combinations thereof.
 13. A clustered functional polyorganosiloxane prepared by the process of claim
 7. 